Our wafer processing services include expertise in the following fields:
- CMP for technology sectors such as 5G, Sensors, Semiconductors, III-V and II-VI Materials, Advanced Packaging, TSV, MEMS, LED, Precision Optical, Photonics, and Nanotechnology.
- Precision Wafer Grinding/Thinning
- Post CMP Wafer Cleaning
- Edge Grinding
- Edge Trim
- Wafer Bonding
In need of SiC Processing? Axus Technology’s recent process improvements have yielded a material removal rate above 10 microns per hour on the silicon face. As a major industry breakthrough for Advanced Single-Wafer Silicon Carbide CMP, we’re providing SiC wafer suppliers with the most advanced CMP system on the market and unmatched performance benefits. The state-of-the-art Capstone® CMP system, coupled with our Crystal carrier (specifically designed for fragile wafer handling and advanced profile control), delivers premium-quality SiC substrates with sub-micron TTV and sub-Angstrom surface finish. The net result for Capstone® users is higher throughput while reducing consumables usage and cost of ownership (CoO) significantly.