CAPSTONE CS200-sa

The new Capstone® CS200 series is the next-generation CMP processing tool from Axus Technology offering the best-in-market performance for 100, 150, and 200mm wafer sizes. The state-of-the-art system architecture includes a superior load-polish-unload sequence for high throughput process capability and reduced system footprint. Capstone® provides more efficient application and utilization of slurry, providing 40-50% reduction in slurry consumption. The unique pad conditioning system also provides up to double the pad life of other CMP tools. The Capstone® CS200 series brings significant reduction in CoO, substantially reducing overall CMP process costs.

CS200-sa (Standalone Configuration):

• Smallest footprint, most flexible architecture, dual wafer size processing with no hardware or software modification
• Easily added to fabs with existing cleaning equipment
• True Bridge tool, can run two different wafer sizes simultaneously

Standard Features:

• Multizone Wafer Carriers (Concentra, Avalon, Crystal)
• 100mm, 150mm, and 200mm capable
• Completely Independent Spindles
• Unlimited Wafer Flip Capability
• Linear Pad Conditioner with Symmetrical Travel Pattern
• High Pressure D.I. Water Rinse Bar
• Minimal Wafer Handling
• Smart-slip Sensor System
• Slurry Flow Controllers
• On-board, State-of-the-Art High Speed Industrial Control Network
• Connectivity

Optional Features:

• Motor Current EndPoint Detection
• Thin Wafer Handling Solutions
• Clear Wafer Sensing Solutions
• Final Platen Conditioning System
• CMP-Idle-Mode Water Recirculating System
• Capstone Optical EndPoint Detection

Other Configurations:

• Capstone CS200-i
• Capstone CS200-m