CAPSTONE CS200-sa

The new Capstone™ CS200 series is the next-generation CMP processing tool from Axus Technology offering the best-in-market performance for 100, 150, and 200mm wafer sizes. The state-of-the-art system architecture includes a superior load-polish-unload sequence for high throughput process capability and reduced system footprint. Capstone provides more efficient application and utilization of slurry, providing 40-50% reduction in slurry consumption. The unique pad conditioning system also provides up to double the pad life of other CMP tools. The Capstone™ CS200 series brings significant reduction in CoO, substantially reducing overall CMP process costs.

CS200-sa (Standalone Configuration):

  • Smallest footprint, most flexible architecture, dual wafer size processing with no hardware or software modification
  • Easily added to fabs with existing cleaning equipment
  • True Bridge tool, can run two different wafer sizes simultaneously

Standard Features:

  • Multizone Wafer Carriers (Concentra, Avalon, Crystal)
  • 100mm, 150mm, and 200mm capable
  • Completely Independent Spindles
  • Unlimited Wafer Flip Capability
  • Linear Pad Conditioner with Symmetrical Travel Pattern
  • High Pressure D.I. Water Rinse Bar
  • Minimal Wafer Handling
  • Smart-slip Sensor System
  • Slurry Flow Controllers
  • On-board, State-of-the-Art High Speed Industrial Control Network
  • Connectivity

Optional Features:

Other Configurations:

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