Wafer Grinders
Axus offers refurbished Strasbaugh and Disco Wafer Grinders to bring them back to like-new condition.
Wafer/Substrate Cleaning
Axus offers New and Refurbished cleaning equipment to add and improve capabilities.
CMP
Axus is a worldwide seller and distributer of new, remanufactured and refurbished CMP tools and tool upgrades.
Inspection Systems
Surface defects are detected and measured
Slurry Delivery System
Axus has developed a full line of revolutionary Slurry Delivery Systems to get the capabilities of larger slurry systems in a smaller system
CMP, Polishing, Grinding and Cleaning Equipment Experts
Axus Technology offers new, used, refurbished and remanufactured process equipment. Our experienced engineering team excels in the design and delivery of specialized process tool upgrades and improvements to enhance performance such as reliability, throughput, and technical process related advancements. The Axus team can help you maximize the productivity of your existing tools, custom-configure legacy process equipment or engineer, develop, and install our own new, specialty equipment to meet your exact need.
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NEWS AND EVENTS
Axus Partners with CP Display to Accelerate Monolithic 1080p MicroLED Displays to Mainstream AR
Axus partners with Compound Photonics US Corporation to accelerate sub 5 µm pixel microLED development to the mass market.
Axus and CP are partnering to integrate critical wafer-scale processes needed for mass-production scale up of CP’s 3 µm pixel, 0.26” diagonal, 1080p microLED displays for the next generation AR glasses. Specifically, Axus will deploy its state-of-the-art Capstone CMP system with integrated post-CMP clean to enable wafer planarization and surface preparation process solutions for successful wafer-scale bonding of microLED wafers to high-performance CMOS backplanes.
Axus/Plessey Partnership
Axus partners with Plessey Semiconductors to help bring high-performance GaN-on-Silicon monolithic microLED technology to the mass market.
Using tooling from Axus and optimised processes, Plessey Semiconductors has achieved a successful wafer to wafer bond of a 1080p microLED display 0.26” diagonal to a 3-micron pixel-pitch backplane. Much smaller than the 0.7" diagonal 8-micron pixel-pitch active-matrix display previously demonstrated.
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