Platen Restoration Program for Applied Materials Mirra 3400 CMP Tools

Offering a full range of process services for standard semiconductor wafers 50mm – 300mm including coupons.

Many steps are necessary in the manufacture of semiconductors, MEMS, and Nanotechnology devices.  The required process steps almost always include substrate grinding, thinning, edge profiling, edge trimming, then substrate polishing, thin film CMP, post-process cleaning, along with metrology at every step along the way.  Certain applications that call for ultra-thin wafers also require bonding steps.  Although these process steps are quite common, not every supplier is able to give you the results you need.  With top of the line processing equipment, and decades of process knowledge and experience Axus Technology has that expertise.

Axus’ engineering staff at our cleanroom wafer fabrication facility in Chandler, Arizona can handle your processing requirements, whether it be small, medium, or large lot sizes, odd shaped wafers and coupons, any size from 50mm diameter up to 300mm, and nearly any substrate imaginable.  With a highly trained engineering staff with many years of experience, Axus Technology is proud to consistently deliver the very finest results possible.

Axus Technology offers new, used, refurbished and remanufactured process equipment.  Our experienced engineering team excels in the design and delivery of specialized process tool upgrades and improvements to enhance performance such as reliability, throughput, and technical process related advancements. The Axus team can help you maximize the productivity of your existing tools, custom-configure legacy process equipment or engineer, develop, and install our own new, specialty equipment to meet your exact need.

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Axus/Plessey Partnership

Axus partners with Plessey Semiconductors to help bring high-performance GaN-on-Silicon monolithic microLED technology to the mass market.

Using tooling from Axus and optimised processes, Plessey Semiconductors has achieved a successful wafer to wafer bond of a 1080p microLED display 0.26” diagonal to a 3-micron pixel-pitch backplane. Much smaller than the 0.7" diagonal 8-micron pixel-pitch active-matrix display previously demonstrated.

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Visit Us At

Axus will be exhibiting at IMAPS Device Packaging Conference 2020 in Fountain Hills, AZ, March 3-4, 2020

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Visit Us At

Axus will be exhibiting at Semicon West 2020 in San Francisco, CA July 21-23, 2020

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7001 W. Erie St. Suite 1, Chandler, AZ 85226
(480) 705-8000