Strasbaugh 7AF

The Strasbaugh 7AF wafer grinder is an advanced wafer grinding solution for semiconductor, data storage, SOI, LED, and a variety of R&D applications. The 7AF delivers high volume throughput with superior finish and thickness control. The force sensitive mechanics and advanced control system allows adaptive grinding that is determined by grinding wheel dynamics resulting in reduced sub-surface damage and increased product yield.

Common applications for the 7AF are:
– Wafer backgrinding of ICs, MEMS, nanotechnology applications
– Ultra-thinning of BSI, smart cards and mobile phones

STANDARD FEATURES INCLUDE:

  • Fully automated precision polishing
  • Two platen process for post polish buff
  • Multiple slurry dispense
  • In-situ pad conditioner
  • Material compatibility for medium and low pH slurries (1-12)
  • Down force up to 750lbs
  • Controllable wafer back pressure
  • Polish head clean station
  • External interface for end point capability
  • Temperature controlled platens

OPTIONAL FEATURES:

  • SECS II Interface
  • We encourage each of our customers to do an on-site inspection of the tool, where they can review the details of the work accomplished, perform a final operational check of the equipment, and participate in the final testing of the tool.

DATASHEETS

ARE YOU READY?

CONTACT US

UPCOMING EVENTS

 

Visit Us At

Axus will be exhibiting at IWLPC 2019 in San Jose, CA, Oct 22-24, 2019, Booth #18.

READ MORE

 

Visit Us At

Axus will be exhibiting at IMAPS Device Packaging Conference 2020 in Fountain Hills, AZ, March 3-4, 2020

READ MORE

 

Visit Us At

Axus will be exhibiting at Semicon West 2020 in San Francisco, CA July 21-23, 2020

READ MORE

 

DOCUMENT LIBRARY    |    CONTACT
© 2019 AXUS TECHNOLOGY. ALL RIGHTS RESERVED
7001 W. Erie St. Suite 1, Chandler, AZ 85226 
(480) 705-8000