The Strasbaugh 7AF wafer grinder is an advanced wafer grinding solution for semiconductor, data storage, SOI, LED, and a variety of R&D applications. The 7AF delivers high volume throughput with superior finish and thickness control. The force sensitive mechanics and advanced control system allows adaptive grinding that is determined by grinding wheel dynamics resulting in reduced sub-surface damage and increased product yield.
Common applications for the 7AF are:
– Wafer backgrinding of ICs, MEMS, nanotechnology applications
– Ultra-thinning of BSI, smart cards and mobile phones
- SECS II Interface
- We encourage each of our customers to do an on-site inspection of the tool, where they can review the details of the work accomplished, perform a final operational check of the equipment, and participate in the final testing of the tool.
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NEWS AND EVENTS
Axus partners with Plessey Semiconductors to help bring high-performance GaN-on-Silicon monolithic microLED technology to the mass market.
Using tooling from Axus and optimised processes, Plessey Semiconductors has achieved a successful wafer to wafer bond of a 1080p microLED display 0.26” diagonal to a 3-micron pixel-pitch backplane. Much smaller than the 0.7" diagonal 8-micron pixel-pitch active-matrix display previously demonstrated.