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Chandler, Arizona, USA, May 4th, 2021 - Axus Technology (Axus), a leading global provider of CMP, wafer thinning and wafer surface processing solutions for semiconductor applications, has been working diligently to develop and improve leading-edge CMP process performance and hardware capability for advanced single-wafer silicon carbide (SiC) CMP applications. The primary focus of these efforts include: 1) thin/fragile wafer handling......Read More...
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