Leading-edge
Surface Processing
Solutions
Delivering leading-edge CMP, wafer thinning and wafer polishing solutions for semiconductor, MEMS/Nanofabrication, and substrate applications, Axus Technology is the industry expert in providing material processing and CMP foundry services and re-engineering existing equipment to meet new technology requirements.
CMP Processes
& Equipment for
the Future
The Axus team can help you maximize the productivity of your existing tools, custom-configure legacy process equipment or engineer, develop, and install our own new, specialty equipment to meet your exact needs.
CMP, Polishing,
Grinding, Cleaning
Equipment Experts
Axus Technology offers new, used, refurbished and remanufactured process equipment. Our experienced engineering team excels in the design and delivery of specialized process tool upgrades and improvements to enhance performance such as reliability, throughput, and technical process related advancements.
Foundry Lab Leading-edge
Foundry Services &
CMP Services
The team at Axus Technology Foundry and Development Lab can help you identify your CMP needs and work with you to custom design and develop the CMP process that fits your needs for CMP processes, precision wafer grinding technology, post-CMP clean and temporary bonding.
World-leader in
Parts & Services
for CMP tools
Axus Technology is a worldwide provider of exceptional Customer Service when it comes to Field Support and Spare Parts for the legacy processing tools used for the CMP process, Precision Wafer Thinning, and Post-Process wafer cleaning tools including: Platen Restoration, CMP Pad Conditioning, Robot Repair & control systems.
Avalon membrane carrier Axus Carrier
Upgrades = Better
Performance
Axus designed membrane carriers can be retrofitted onto existing CMP tools, significantly enhancing tool performance and reliability. These upgrades offer significantly lower WIW uniformity than the legacy carriers using rigid plates.

The Axus Technology engineering team provides advanced technical solutions for CMP process services ranging from advanced CMP process development to standard production CMP foundry services. With a fully equipped Class 100 cleanroom staffed by engineers with decades of semiconductor process experience, Axus is ready to assist you with all your CMP process needs.

The Axus Technology engineering team provides advanced technical solutions for CMP process services ranging from advanced CMP process development to standard production CMP foundry services. With a fully equipped Class 100 cleanroom staffed by engineers with decades of semiconductor process experience, Axus is ready to assist you with all your CMP process needs.

Required process steps almost always include substrate grinding, thinning, edge profiling, edge trimming, then substrate polishing, thin film CMP, post-process cleaning, along with metrology at every step along the way.  Certain applications that call for ultra-thin wafers also require bonding steps.  Although these process steps are quite common, not every supplier is able to give you the results you need. 

Post CMP clean is an integral part of CMP. The removal of the slurry residues and the polish byproducts from the wafer are essentially for further processing.

Axus Technology offers a variety of wafer bonding process techniques including: temporary wax-on and tape-on bonding, permanent wafer bonding and enhanced temporary bonds where follow-on processing requires stronger bonding of the substrates.

Process Expertise

CMP

Precision Wafer Grind

Post CMP Clean

Temporary Bonding

Process Expertise

CMP

The Axus Technology engineering team provides advanced technical solutions for CMP process services ranging from advanced CMP process development to standard production CMP foundry services. With a fully equipped Class 100 cleanroom staffed by engineers with decades of semiconductor process experience, Axus is ready to assist you with all your CMP process needs.

Precision Wafer Grind

Required process steps almost always include substrate grinding, thinning, edge profiling, edge trimming, then substrate polishing, thin film CMP, post-process cleaning, along with metrology at every step along the way. Certain applications that call for ultra-thin wafers also require bonding steps. Although these process steps are quite common, not every supplier is able to give you the results you need.

Post CMP Clean

Post CMP clean is an integral part of CMP. The removal of the slurry residues and the polish byproducts from the wafer are essentially for further processing.

Temporary Bonding

Axus Technology offers a variety of wafer bonding process techniques including: temporary wax-on and tape-on bonding, permanent wafer bonding and enhanced temporary bonds where follow-on processing requires stronger bonding of the substrates.

Contact for

Equipment

Development Lab

Process Request Form

Contact for

Parts & ServiceS

NEWS AND EVENTS

 

Axus/Plessey Partnership

Axus partners with Plessey Semiconductors to help bring high-performance GaN-on-Silicon monolithic microLED technology to the mass market.

Using tooling from Axus and optimised processes, Plessey Semiconductors has achieved a successful wafer to wafer bond of a 1080p microLED display 0.26” diagonal to a 3-micron pixel-pitch backplane. Much smaller than the 0.7" diagonal 8-micron pixel-pitch active-matrix display previously demonstrated.

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