The Axus Technology engineering team provides advanced technical solutions for CMP process services ranging from advanced CMP process development to standard production CMP foundry services. With a fully equipped Class 100 cleanroom staffed by engineers with decades of semiconductor process experience, Axus is ready to assist you with all your CMP process needs.

The Axus Technology engineering team provides advanced technical solutions for CMP process services ranging from advanced CMP process development to standard production CMP foundry services. With a fully equipped Class 100 cleanroom staffed by engineers with decades of semiconductor process experience, Axus is ready to assist you with all your CMP process needs.

Required process steps almost always include substrate grinding, thinning, edge profiling, edge trimming, then substrate polishing, thin film CMP, post-process cleaning, along with metrology at every step along the way.  Certain applications that call for ultra-thin wafers also require bonding steps.  Although these process steps are quite common, not every supplier is able to give you the results you need. 

Post CMP clean is an integral part of CMP. The removal of the slurry residues and the polish byproducts from the wafer are essentially for further processing.

Axus Technology offers a variety of wafer bonding process techniques including: temporary wax-on and tape-on bonding, permanent wafer bonding and enhanced temporary bonds where follow-on processing requires stronger bonding of the substrates.

Process Expertise

CMP

Precision Wafer Grind

Post CMP Clean

Temporary Bonding

Process Expertise

CMP

The Axus Technology engineering team provides advanced technical solutions for CMP process services ranging from advanced CMP process development to standard production CMP foundry services. With a fully equipped Class 100 cleanroom staffed by engineers with decades of semiconductor process experience, Axus is ready to assist you with all your CMP process needs.

Precision Wafer Grind

Required process steps almost always include substrate grinding, thinning, edge profiling, edge trimming, then substrate polishing, thin film CMP, post-process cleaning, along with metrology at every step along the way. Certain applications that call for ultra-thin wafers also require bonding steps. Although these process steps are quite common, not every supplier is able to give you the results you need.

Post CMP Clean

Post CMP clean is an integral part of CMP. The removal of the slurry residues and the polish byproducts from the wafer are essentially for further processing.

Temporary Bonding

Axus Technology offers a variety of wafer bonding process techniques including: temporary wax-on and tape-on bonding, permanent wafer bonding and enhanced temporary bonds where follow-on processing requires stronger bonding of the substrates.

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Axus will be exhibiting at IWLPC 2019 in San Jose, CA, Oct 22-24, 2019, Booth #18.

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Axus will be exhibiting at IMAPS Device Packaging Conference 2020 in Fountain Hills, AZ, March 3-4, 2020

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Axus will be exhibiting at Semicon West 2020 in San Francisco, CA July 21-23, 2020

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