Capstone Demo Overview

The new Capstone® CS200 series is the next-generation CMP processing tool from Axus Technology offering the best-in-market wafer polishing performance for 100, 150, and 200mm wafer sizes.

The state-of-the-art system architecture includes a superior load-polish-unload sequence for high throughput process capability and reduced system footprint. Capstone® provides more efficient application and utilization of chemical mechanical polishing slurry, offering a 40-50% reduction in slurry consumption. The unique pad conditioning system also provides up to double the pad life of other CMP tools. The Capstone® CS200 series is the wafer processing equipment of the future and brings significant reduction in CoO, substantially reducing overall CMP process costs.

In need of SiC Processing? The state-of-the-art Capstone® CMP system, coupled with our Crystal carrier (specifically designed for fragile wafer handling and advanced profile control), delivers premium-quality silicon carbide substrates with sub-micron TTV and sub-Angstrom surface finish.

Available Configurations:

CS200-ma (Multi-Load/Unload Aquarius Cleaner Configuration):

• Can function as a standalone CMP polishing system, or as a fully automated Dry in-Dry out system with the integrated Double Sided Post-CMP cleaner
• True Bridge tool, can run two different wafer sizes simultaneously

CS200-sa (Standalone Configuration):

• Smallest footprint, most flexible architecture, dual wafer size processing with no hardware or software modification
• True Bridge tool, can run two different wafer sizes simultaneously

CS200-ia (Integrated Aquarius Cleaner Configuration):

• Advanced CMP System with fully integrated Double Sided Post-CMP cleaner for dry-in, dry-out applications
• True Bridge tool, can run two different wafer sizes simultaneously