Wafer Grinding Technology
Backgrinding, wafer grinding, or wafer thinning technology makes possible the necessary reduction in wafer thickness necessary for improved chip performance in today’s leading-edge technology. Axus Technology can help you choose the right wafer grinding equipment to provide precise control, exacting dimensions and challenging specification solutions. Precise wafer thickness control is critical in manufacturing integrated circuits, MEMS, LEDs, and Nanotechnology devices.
Edge Profiling (or grinding), and Edge Trimming are specific backgrinding technologies that employ precise diamond grinding wheels within robust, precision grinders that incorporate air-bearing spindles to minimize harmonic resonance.
Precision backgrinding is especially well suited for processing hard, brittle materials such as silicon, silicon carbide, sapphire, Indium Phosphide, Gallium Arsenide, glass, and many others.
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Axus partners with Plessey Semiconductors to help bring high-performance GaN-on-Silicon monolithic microLED technology to the mass market.
Using tooling from Axus and optimised processes, Plessey Semiconductors has achieved a successful wafer to wafer bond of a 1080p microLED display 0.26” diagonal to a 3-micron pixel-pitch backplane. Much smaller than the 0.7" diagonal 8-micron pixel-pitch active-matrix display previously demonstrated.