Strasbaugh 7AA wafer grinder controls Wafer Grinders Disco DFG8540 surface grinder Wafer Grinders Strasbaugh 7AF wafer grinder Wafer Grinders Ultra-thin wafer handling to 100μm and less Wafer Grinders

Wafer Grinding Technology

Backgrinding, wafer grinding, or wafer thinning technology makes possible the necessary reduction in wafer thickness necessary for improved chip performance in today’s leading-edge technology. Axus Technology can help you choose the right wafer grinding equipment to provide precise control, exacting dimensions and challenging specification solutions. Precise wafer thickness control is critical in manufacturing integrated circuits, MEMS, LEDs, and Nanotechnology devices.

Edge Profiling (or grinding), and Edge Trimming are specific backgrinding technologies that employ precise diamond grinding wheels within robust, precision grinders that incorporate air-bearing spindles to minimize harmonic resonance.

Precision backgrinding is especially well suited for processing hard, brittle materials such as silicon, silicon carbide, sapphire, Indium Phosphide, Gallium Arsenide, glass, and many others.

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NEWS AND EVENTS

 

Axus Partners with CP Display to Accelerate Monolithic 1080p MicroLED Displays to Mainstream AR

Axus partners with Compound Photonics US Corporation to accelerate sub 5 µm pixel microLED development to the mass market.

Axus and CP are partnering to integrate critical wafer-scale processes needed for mass-production scale up of CP’s 3 µm pixel, 0.26” diagonal, 1080p microLED displays for the next generation AR glasses. Specifically, Axus will deploy its state-of-the-art Capstone CMP system with integrated post-CMP clean to enable wafer planarization and surface preparation process solutions for successful wafer-scale bonding of microLED wafers to high-performance CMOS backplanes.

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Axus/Plessey Partnership

Axus partners with Plessey Semiconductors to help bring high-performance GaN-on-Silicon monolithic microLED technology to the mass market.

Using tooling from Axus and optimised processes, Plessey Semiconductors has achieved a successful wafer to wafer bond of a 1080p microLED display 0.26” diagonal to a 3-micron pixel-pitch backplane. Much smaller than the 0.7" diagonal 8-micron pixel-pitch active-matrix display previously demonstrated.

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