Disco 810 wafer grinder Disco DAG810 Disco DAG810 Disco DAG810

Disco DAG810

Disco DAG810 automatic wafer grinder
Disco DAG810 automatic wafer grinder Disco 810 wafer grinder touchscreen Disco DAG810 ring frame

Disco DAG810 is a single axis automatic wafer grinder that can grind wafers up to 300mm diameter. With one air bearing grind spindle and one vacuum chuck mounted on a high precision mechanical lower spindle this grinder has a relatively small footprint of only 11 square feet. This grinder can perform either standard in-feed (plunge) grinding or optional creep feed grinding.

With optimized grinding of 200mm SEMI grade silicon wafers, the DAG810 is capable of:
Thickness control of ± 1.5 micron (WTW)
TTV across the wafer of ≤ 1.5 micron

STANDARD FEATURES INCLUDE:

  • Small Footprint – Perfect for research labs and smaller production
  • Grinds wafers up to 300mm
  • In-feed grinding with wafer rotation
  • Ultra-stiff air bearing grind spindle
  • Porous chuck table with vacuum chuck
  • Manual load/unload

OPTIONAL FEATURES:

  • Either one or two height gauges
  • In-feed grinding for work pieces up to 300mm diameter
  • Creep-feed grinding for work pieces up to 200mm diameter
  • 200mm ring frame grinding
  • Vacuum system with fluid separation unit
  • Filtration system

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NEWS AND EVENTS

 

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Chandler, Arizona, USA, – Axus Technology (Axus), a leading global provider of CMP, wafer thinning and wafer surface processing solutions for semiconductor applications, is excited to be partnering with GE Research, GE Aviation Systems, and InertiaWave, Inc. on the production of an innovative single-chip device. SEMI, through their MEMS & Sensors Industry Group (MSIG) and FlexTech Group has provided a great opportunity and platform to tackle PNT’s (Positioning, Navigation, and Timing) challenges with innovative solutions for GPS-denied environments.

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Using tooling from Axus and optimised processes, Plessey Semiconductors has achieved a successful wafer to wafer bond of a 1080p microLED display 0.26” diagonal to a 3-micron pixel-pitch backplane. Much smaller than the 0.7" diagonal 8-micron pixel-pitch active-matrix display previously demonstrated.

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Axus and CP are partnering to integrate critical wafer-scale processes needed for mass-production scale up of CP’s 3 µm pixel, 0.26” diagonal, 1080p microLED displays for the next generation AR glasses. Specifically, Axus will deploy its state-of-the-art Capstone CMP system with integrated post-CMP clean to enable wafer planarization and surface preparation process solutions for successful wafer-scale bonding of microLED wafers to high-performance CMOS backplanes.

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