Disco DAG810
Disco DAG810 is a single axis automatic wafer grinder that can grind wafers up to 300mm diameter. With one air bearing grind spindle and one vacuum chuck mounted on a high precision mechanical lower spindle this grinder has a relatively small footprint of only 11 square feet. This grinder can perform either standard in-feed (plunge) grinding or optional creep feed grinding.
With optimized grinding of 200mm SEMI grade silicon wafers, the DAG810 is capable of:
Thickness control of ± 1.5 micron (WTW)
TTV across the wafer of ≤ 1.5 micron
STANDARD FEATURES INCLUDE:
- Small Footprint – Perfect for research labs and smaller production
- Grinds wafers up to 300mm
- In-feed grinding with wafer rotation
- Ultra-stiff air bearing grind spindle
- Porous chuck table with vacuum chuck
- Manual load/unload
OPTIONAL FEATURES:
- Either one or two height gauges
- In-feed grinding for work pieces up to 300mm diameter
- Creep-feed grinding for work pieces up to 200mm diameter
- 200mm ring frame grinding
- Vacuum system with fluid separation unit
- Filtration system
