Disco DAG810

Disco DAG810 is a single axis automatic wafer grinder that can grind wafers up to 300mm diameter. With one air bearing grind spindle and one vacuum chuck mounted on a high precision mechanical lower spindle this grinder has a relatively small footprint of only 11 square feet. This grinder can perform either standard in-feed (plunge) grinding or optional creep feed grinding.

STANDARD FEATURES INCLUDE:

  • Grinds wafers up to 300mm
  • In-feed grinding with wafer rotation
  • Air bearing grind spindle
  • Porous chuck table with vacuum chuck
  • Manual load/unload

OPTIONAL FEATURES:

  • Either one or two height gauges
  • In-feed grinding for work pieces up to 300mm diameter
  • Creep-feed grinding for work pieces up to 200mm diameter
  • 200mm ring frame grinding
  • Vacuum system with fluid separation unit

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