Disco 810 wafer grinder Disco DAG810 Disco DAG810 Disco DAG810

Disco DAG810

Disco DAG810 automatic wafer grinder
Disco DAG810 automatic wafer grinder Disco 810 wafer grinder touchscreen Disco DAG810 ring frame

Disco DAG810 is a single axis automatic wafer grinder that can grind wafers up to 300mm diameter. With one air bearing grind spindle and one vacuum chuck mounted on a high precision mechanical lower spindle this grinder has a relatively small footprint of only 11 square feet. This grinder can perform either standard in-feed (plunge) grinding or optional creep feed grinding.

With optimized grinding of 200mm SEMI grade silicon wafers, the DAG810 is capable of:
Thickness control of ± 1.5 micron (WTW)
TTV across the wafer of ≤ 1.5 micron


  • Small Footprint – Perfect for research labs and smaller production
  • Grinds wafers up to 300mm
  • In-feed grinding with wafer rotation
  • Ultra-stiff air bearing grind spindle
  • Porous chuck table with vacuum chuck
  • Manual load/unload


  • Either one or two height gauges
  • In-feed grinding for work pieces up to 300mm diameter
  • Creep-feed grinding for work pieces up to 200mm diameter
  • 200mm ring frame grinding
  • Vacuum system with fluid separation unit
  • Filtration system


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7001 W. Erie St. Suite 1, Chandler, AZ 85226
(480) 705-8000