Disco 810 wafer grinder Disco DAG810 Disco DAG810 Disco DAG810

Disco DAG810

Disco DAG810 automatic wafer grinder
Disco DAG810 automatic wafer grinder Disco 810 wafer grinder touchscreen Disco DAG810 ring frame

Disco DAG810 is a single axis automatic wafer grinder that can grind wafers up to 300mm diameter. With one air bearing grind spindle and one vacuum chuck mounted on a high precision mechanical lower spindle this grinder has a relatively small footprint of only 11 square feet. This grinder can perform either standard in-feed (plunge) grinding or optional creep feed grinding.

STANDARD FEATURES INCLUDE:

  • Grinds wafers up to 300mm
  • In-feed grinding with wafer rotation
  • Air bearing grind spindle
  • Porous chuck table with vacuum chuck
  • Manual load/unload

OPTIONAL FEATURES:

  • Either one or two height gauges
  • In-feed grinding for work pieces up to 300mm diameter
  • Creep-feed grinding for work pieces up to 200mm diameter
  • 200mm ring frame grinding
  • Vacuum system with fluid separation unit
  • Filtration system

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Axus partners with Plessey Semiconductors to help bring high-performance GaN-on-Silicon monolithic microLED technology to the mass market.

Using tooling from Axus and optimised processes, Plessey Semiconductors has achieved a successful wafer to wafer bond of a 1080p microLED display 0.26” diagonal to a 3-micron pixel-pitch backplane. Much smaller than the 0.7" diagonal 8-micron pixel-pitch active-matrix display previously demonstrated.

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