What is Wafer Bonding?
Wafer bonding is commonly used in Front-end of line (FEOL) operational steps as wafer-to-wafer bonding provides strength if the device wafer is to be thinned to ultra-thin dimensions. This precision bonding occurs during the TSV, BSI and some MEMS steps and provides wafer safety during the handling and follow-on processes.
Device wafers in the TSV and BSI processes are put through an ultra-thin grinding process, which reduces the device wafer thickness to 50 µm for TSV, and even as thin as 4µm for BSI. For this thin of a wafer, a supportive substrate is required.
As a part of the manufacturing process, it is common for the bonded wafers to then go through CMP steps for both planarization and surface preparation. Axus Technology offers a variety of wafer bonding process techniques including temporary wax-on and tape-on bonding, permanent wafer bonding, and enhanced bonds.
The type of bonding that is chosen is based upon the application and the materials involved. Superior bonding results are dependent upon upstream processing steps such as precision grinding, Chemical Mechanical Polishing (CMP), and post-process cleaning. Axus Technology manages the entire bonding process to mitigate the customer’s risk and shorten the processing time.
For more information and a complete description of the process used at Axus Technology, please see our
Wafer Bonding Application Note.
How Axus Technology Can Help You
FOR PROCESS SERVICES: Axus Technology’s Process Development Lab and Foundry Services Department has the required equipment and expertise available to perform a number of critical process steps including wafer bonding on a contractual basis on your wafer substrates.