The remanufactured Model 6EG CMP Planarizer by Axus Technology, provides an economical way for limited production fabs, and research groups to polish thin films on 300mm substrates, achieving polishing results comparable to those possible on multi-million-dollar production level CMP tools. The “Titan,” advanced membrane wafer carrier upgrade delivers significant process and productivity improvements.
Semi-Automatic Load/Unload, coupled with automatic polishing cycle sequencing programmable through the PC controller via the color touch-screen GUI, gives the process engineer the features and benefits of high-throughput, large footprint, expensive production level CMP tools. The Model 6EG from Axus Technology is the affordable solution, providing the benefits of state-of-the-art CMP in a small footprint polishing tool, and at an attractive price
STANDARD FEATURES INCLUDE:
Closed-loop table drive motors and spindle drive motors help ensure consistent process results.
The programmable pad conditioning system provides in-situ and/or ex-situ programmable selective pad conditioning for:
Consistent removal rates
Optimized within-wafer-non- uniformity (WIWNU)
23 zones of selectable conditioning parameters such as traversing time, dwell time, down force, and rpm.
Robust design and quality components help to minimize maintenance requirements thus driving down the total Cost-of-Ownership
The relatively small footprint works well in smaller lab spaces and in the typical R&D environment
- Titan Carrier Upgrade
Improves Edge Exclusion to 3mm
Increases removal rate by up to 2X or more, over first gen OEM carriers
Results in improved WIWNU and WTWNU
Improves throughput and reduces process cost
Process Request Form
Parts & ServiceS
NEWS AND EVENTS
Axus Partners with CP Display to Accelerate Monolithic 1080p MicroLED Displays to Mainstream AR
Axus partners with Compound Photonics US Corporation to accelerate sub 5 µm pixel microLED development to the mass market.
Axus and CP are partnering to integrate critical wafer-scale processes needed for mass-production scale up of CP’s 3 µm pixel, 0.26” diagonal, 1080p microLED displays for the next generation AR glasses. Specifically, Axus will deploy its state-of-the-art Capstone CMP system with integrated post-CMP clean to enable wafer planarization and surface preparation process solutions for successful wafer-scale bonding of microLED wafers to high-performance CMOS backplanes.
Axus partners with Plessey Semiconductors to help bring high-performance GaN-on-Silicon monolithic microLED technology to the mass market.
Using tooling from Axus and optimised processes, Plessey Semiconductors has achieved a successful wafer to wafer bond of a 1080p microLED display 0.26” diagonal to a 3-micron pixel-pitch backplane. Much smaller than the 0.7" diagonal 8-micron pixel-pitch active-matrix display previously demonstrated.