The Applied Materials Mirra CMP Tool is a Dry In – Wet Out (DI-WO) type of CMP machine which incorporates three polishing platens. The four wafer carriers are supported by a carousel transfer mechanism that moves the wafers through a one, two, or three step polishing process. This AMAT CMP polisher will process wafers from 150 to 200mm in diameter, and can be used for the planarization of thin films such as oxide, tungsten, and Polysilicon.
- MIRRA TRAK – provides Dry In-Dry Out (DIDO) processing and is integrated with the OnTRAK “Integra” double sided wafer cleaning system.
- MIRRA MESA – provides fully automated Dry In-Dry Out (DIDO) processing and is integrated with the MESA cleaner. A FABS unit is added that can accommodate up to four 25-wafer cassettes.
- MIRRA DNS – integrated with the DNS AS-2000 Post-CMP cleaning tool and includes the FABS (Factory Automation Buffer Station) and an LTA (Linear Transfer Assembly).