Disco DFG8540

Disco DFG8540 system is a fully automatic in-feed surface grinder. With its conventional two-spindle, three-chuck design, the DFG8540 is capable of performing both large diameter grinding and thin-finish grinding. The processing position of the grinding wheel coincides with the chuck table for each spindle for improved grinding performance.

STANDARD FEATURES INCLUDE:

• Automated thinning up to 200mm diameter wafers
• Ultra-thin wafer handling to 100μm and less
• DBG option available and plasma-ready
• Flat/Notch alignment orientation
• Interior grind water nozzle
• Chuck/Spinner table
• Positioning and stopping system
• 2 air bearing grind spindles, 3 rotary-chuck tables

OPTIONAL FEATURES:

• Vacuum system with automatic fluid separation unit
• Temperature control system for stabilizing process results

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Axus will be exhibiting at Semicon West 2020 in San Francisco, CA July 21-23, 2020

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