Ultra-thin wafer handling to 100μm and less Disco DFG8540 Disco DFG8540 fully automatic in-feed surface grinder Disco DFG8540 Disco DFG8540 grinder Disco DFG8540 Disco DFG8540 surface grinder Disco DFG8540

Disco DFG8540

Disco DFG8540 fully automatic in-feed surface grinder
Disco DFG8540 fully automatic in-feed surface grinder Disco DFG8540 wafer grinder Disco DFG8540 fully automatic in-feed surface grinder

Disco DFG8540 system is a fully automatic in-feed surface grinder. With its conventional two-spindle, three-chuck design, the DFG8540 is capable of performing both large diameter grinding and thin-finish grinding. The processing position of the grinding wheel coincides with the chuck table for each spindle for improved grinding performance.

STANDARD FEATURES INCLUDE:

  • Automated thinning up to 200mm diameter wafers
  • Ultra-thin wafer handling to 100μm and less
  • DBG option available and plasma-ready
  • Flat/Notch alignment orientation
  • Interior grind water nozzle
  • Chuck/Spinner table
  • Positioning and stopping system
  • 2 air bearing grind spindles, 3 rotary-chuck tables

OPTIONAL FEATURES:

  • Vacuum system with automatic fluid separation unit
  • Temperature control system for stabilizing process results
  • Filtration system

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NEWS AND EVENTS

 

Axus Technology partners with top industry research leaders on the production of an innovative single-chip device for the PNT market.

Chandler, Arizona, USA, – Axus Technology (Axus), a leading global provider of CMP, wafer thinning and wafer surface processing solutions for semiconductor applications, is excited to be partnering with GE Research, GE Aviation Systems, and InertiaWave, Inc. on the production of an innovative single-chip device. SEMI, through their MEMS & Sensors Industry Group (MSIG) and FlexTech Group has provided a great opportunity and platform to tackle PNT’s (Positioning, Navigation, and Timing) challenges with innovative solutions for GPS-denied environments.

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Axus/Plessey Partnership

Axus partners with Plessey Semiconductors to help bring high-performance GaN-on-Silicon monolithic microLED technology to the mass market.

Using tooling from Axus and optimised processes, Plessey Semiconductors has achieved a successful wafer to wafer bond of a 1080p microLED display 0.26” diagonal to a 3-micron pixel-pitch backplane. Much smaller than the 0.7" diagonal 8-micron pixel-pitch active-matrix display previously demonstrated.

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Axus Partners with CP Display to Accelerate Monolithic 1080p MicroLED Displays to Mainstream AR

Axus partners with Compound Photonics US Corporation to accelerate sub 5 µm pixel microLED development to the mass market.

Axus and CP are partnering to integrate critical wafer-scale processes needed for mass-production scale up of CP’s 3 µm pixel, 0.26” diagonal, 1080p microLED displays for the next generation AR glasses. Specifically, Axus will deploy its state-of-the-art Capstone CMP system with integrated post-CMP clean to enable wafer planarization and surface preparation process solutions for successful wafer-scale bonding of microLED wafers to high-performance CMOS backplanes.

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