Disco DFG8540

Disco DFG8540 system is a fully automatic in-feed surface grinder. With its conventional two-spindle, three-chuck design, the DFG8540 is capable of performing both large diameter grinding and thin-finish grinding. The processing position of the grinding wheel coincides with the chuck table for each spindle for improved grinding performance.

STANDARD FEATURES INCLUDE:

  • Automated thinning up to 200mm diameter wafers
  • Ultra-thin wafer handling to 100μm and less
  • DBG option available and plasma-ready
  • Flat/Notch alignment orientation
  • Interior grind water nozzle
  • Chuck/Spinner table
  • Positioning and stopping system
  • 2 air bearing grind spindles, 3 rotary-chuck tables

OPTIONAL FEATURES:

  • Vacuum system with automatic fluid separation unit
  • Temperature control system for stabilizing process results

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