



Disco DFG8540 system is a fully automatic in-feed surface grinder. With its conventional two-spindle, three-chuck design, the DFG8540 is capable of performing both large diameter grinding and thin-finish grinding. The processing position of the grinding wheel coincides with the chuck table for each spindle for improved grinding performance.
STANDARD FEATURES INCLUDE:
- Automated thinning up to 200mm diameter wafers
- Ultra-thin wafer handling to 100μm and less
- DBG option available and plasma-ready
- Flat/Notch alignment orientation
- Interior grind water nozzle
- Chuck/Spinner table
- Positioning and stopping system
- 2 air bearing grind spindles, 3 rotary-chuck tables
OPTIONAL FEATURES:
- Vacuum system with automatic fluid separation unit
- Temperature control system for stabilizing process results
- Filtration system
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NEWS & EVENTS
Chandler, Arizona, USA, – Axus Technology (Axus), a leading global provider of CMP, wafer thinning and wafer surface processing solutions for semiconductor applications, is excited to be partnering with GE Research, GE Aviation Systems, and InertiaWave, Inc. on the production of an innovative single-chip device. SEMI, through their MEMS & Sensors Industry Group (MSIG) and FlexTech Group has provided a......Read More...