Axus now offers the Berkeley TS-5112-F LCD color touchscreen, offering full drop-in replacement compatibility for:
- Fluke 1020
- Fluke 1021
- Fluke 1030
- Fluke Dynapro 1050
- Fluke Dynapro 1051
- 3M 3170
- Berkeley Process Control TS-3000
- Berkeley Process Control TS-3200
The TS-5112-F can be used in these applications with no changes to existing system software.
- 12.1″ SVGA TFT LCD with high luminance
- Slim and compact design with Al-Mg housing
- Fanless cooling system
- NEMA4/IP65 compliant front panel
- Windows CE.NET Operating System
- 16mb CompactFlash™ storage (upgradable to 256mb)
- 4 serial ports, 1 Ethernet port (10/100Mbps), 2 PS/2 ports
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NEWS AND EVENTS
Axus Technology partners with top industry research leaders on the production of an innovative single-chip device for the PNT market.
Chandler, Arizona, USA, – Axus Technology (Axus), a leading global provider of CMP, wafer thinning and wafer surface processing solutions for semiconductor applications, is excited to be partnering with GE Research, GE Aviation Systems, and InertiaWave, Inc. on the production of an innovative single-chip device. SEMI, through their MEMS & Sensors Industry Group (MSIG) and FlexTech Group has provided a great opportunity and platform to tackle PNT’s (Positioning, Navigation, and Timing) challenges with innovative solutions for GPS-denied environments.
Axus partners with Plessey Semiconductors to help bring high-performance GaN-on-Silicon monolithic microLED technology to the mass market.
Using tooling from Axus and optimised processes, Plessey Semiconductors has achieved a successful wafer to wafer bond of a 1080p microLED display 0.26” diagonal to a 3-micron pixel-pitch backplane. Much smaller than the 0.7" diagonal 8-micron pixel-pitch active-matrix display previously demonstrated.
Axus Partners with CP Display to Accelerate Monolithic 1080p MicroLED Displays to Mainstream AR
Axus partners with Compound Photonics US Corporation to accelerate sub 5 µm pixel microLED development to the mass market.
Axus and CP are partnering to integrate critical wafer-scale processes needed for mass-production scale up of CP’s 3 µm pixel, 0.26” diagonal, 1080p microLED displays for the next generation AR glasses. Specifically, Axus will deploy its state-of-the-art Capstone CMP system with integrated post-CMP clean to enable wafer planarization and surface preparation process solutions for successful wafer-scale bonding of microLED wafers to high-performance CMOS backplanes.