CAPSTONE CS200-ma
The new Capstone™ CS200 series is the next-generation CMP processing tool from Axus Technology offering the best-in-market performance for 100, 150, and 200mm wafer sizes. The state-of-the-art system architecture includes a superior load-polish-unload sequence for high throughput process capability and reduced system footprint. Capstone provides more efficient application and utilization of slurry, providing 40-50% reduction in slurry consumption. The unique pad conditioning system also provides up to double the pad life of other CMP tools. The Capstone™ CS200 series brings significant reduction in CoO, substantially reducing overall CMP process costs.
CS200-ma (Multi-Load/Unload Aquarius Cleaner Configuration):
- Can function as a standalone CMP polishing system, or as a fully automated Dry in-Dry out system with the integrated Double Sided Post-CMP cleaner
- True Bridge tool, can run two different wafer sizes simultaneously
Standard Features:
- Multizone Wafer Carriers (Concentra, Avalon, Crystal)
- 100mm, 150mm, and 200mm capable
- Completely Independent Wafer Movement
- Unlimited Wafer Flip Capability
- Linear Pad Conditioner with Symmetrical Travel Pattern
- High Pressure D.I. Water Rinse Bar
- Minimal Wafer Handling
- Smart-slip Sensor System
- Slurry Flow Controllers
- On-board, State-of-the-Art High Speed Industrial Control Network
- Connectivity
- Fully Integrated Post CMP Cleaner
Optional Features:
- Optical and Motor Current EPD Systems
- Platen Cooling
- CMP-Idle-Mode Water Recirculating System
