OnTrak DSS 200 Series 1 double-sided PVA scrubber ONTRAK DSS200 Series 1 OnTrak DSS 200 Series 2 wafer cleaning system ONTRAK DSS200 Series 1 OnTrak DSS 200 Series 1 double-sided PVA scrubber ONTRAK DSS200 Series 1

ONTRAK DSS200 Series 1

OnTrak DSS 200 Series 1 Post CMP cleaning system
OnTrak DSS 200 Series 1 Post CMP cleaning system OnTrak DSS 200 Series 1 double-sided PVA scrubber OnTrak DSS 200 DSS-200 Series 1 cost-effective cleaning system

OnTrak DSS 200 Series 1 double-sided PVA scrubber is designed to clean 100mm to 200mm wafers. It provides consistent, ultra-clean processing for a wide variety of applications.

The DSS-200 Series 1 is a proven, cost-effective cleaning system for the following applications:

  • Post-CMP Cleaning: oxide, polysilicon, nitride, tungsten, aluminum and copper
  • General purpose cleaning: post-CVD oxides, post-metallization, surface topography cleaning, trench cleaning
  • Silicon cleaning: prime silicon, reclaim silicon, fab monitor reclaim

STANDARD FEATURES INCLUDE:

  • Universal load station • Double sided PVA scrub
  • Dual brush boxes
  • Ammoniadispense
  • IR assisted spin dry station
  • Robotic unload
  • Vertical unload station
  • Touchscreen controls

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NEWS AND EVENTS

 

Axus Technology partners with top industry research leaders on the production of an innovative single-chip device for the PNT market.

Chandler, Arizona, USA, – Axus Technology (Axus), a leading global provider of CMP, wafer thinning and wafer surface processing solutions for semiconductor applications, is excited to be partnering with GE Research, GE Aviation Systems, and InertiaWave, Inc. on the production of an innovative single-chip device. SEMI, through their MEMS & Sensors Industry Group (MSIG) and FlexTech Group has provided a great opportunity and platform to tackle PNT’s (Positioning, Navigation, and Timing) challenges with innovative solutions for GPS-denied environments.

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Axus/Plessey Partnership

Axus partners with Plessey Semiconductors to help bring high-performance GaN-on-Silicon monolithic microLED technology to the mass market.

Using tooling from Axus and optimised processes, Plessey Semiconductors has achieved a successful wafer to wafer bond of a 1080p microLED display 0.26” diagonal to a 3-micron pixel-pitch backplane. Much smaller than the 0.7" diagonal 8-micron pixel-pitch active-matrix display previously demonstrated.

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Axus Partners with CP Display to Accelerate Monolithic 1080p MicroLED Displays to Mainstream AR

Axus partners with Compound Photonics US Corporation to accelerate sub 5 µm pixel microLED development to the mass market.

Axus and CP are partnering to integrate critical wafer-scale processes needed for mass-production scale up of CP’s 3 µm pixel, 0.26” diagonal, 1080p microLED displays for the next generation AR glasses. Specifically, Axus will deploy its state-of-the-art Capstone CMP system with integrated post-CMP clean to enable wafer planarization and surface preparation process solutions for successful wafer-scale bonding of microLED wafers to high-performance CMOS backplanes.

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