Ontrak DSS200 Series 2

OnTrak DSS 200 Series 2 double-sided PVA scrubber offers production-proven cleaning results for removing slurry particles. Depending on the application, throughputs of 45-65 wafers per hour are attainable, making the DSS-200 Series 2 the most costeffective wafer cleaning system for wafers from 100mm to 200mm.

The DSS-200 Series 2 can accommodate a wide range of cleaning process applications such as:

  • Post-CMP cleaning: oxide, polysilicon, nitride, tungsten, aluminum and copper
  • General purpose cleaning: Pre and Post-CVD oxides, postmetallization, surface topography, trench
  • Silicon cleaning: prime silicon, reclaim silicon, fab monitor reclaim

STANDARD FEATURES INCLUDE:

  • 200mm ergonomic load station
  • Double sided PVA scrub
  • Dual brush boxes
  • Dark plastic covers protect light sensitive wafers
  • Ammonia dispense
  • IR assisted spin dry station
  • Robotic unload
  • Vertical unload station
  • Touchscreen controls

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