OnTrak DSS 200 Series 2 double-sided PVA scrubber Ontrak DSS200 Series 2 OnTrak DSS 200 Series 2 wafer cleaning system Ontrak DSS200 Series 2 OnTrak DSS 200 Series 2 double-sided PVA scrubber Ontrak DSS200 Series 2

Ontrak DSS200 Series 2

OnTrak DSS 200 Series 2 wafer cleaning system
OnTrak DSS 200 Series 2 wafer cleaning system OnTrak Series 2 wafer cleaning system for wafers from 100mm to 200mm

OnTrak DSS 200 Series 2 double-sided PVA scrubber offers production-proven cleaning results for removing slurry particles. Depending on the application, throughputs of 45-65 wafers per hour are attainable, making the DSS-200 Series 2 the most cost-effective wafer cleaning system for wafers from 100mm to 200mm.

The DSS-200 Series 2 can accommodate a wide range of cleaning process applications such as:

  • Post-CMP cleaning: oxide, polysilicon, nitride, tungsten, aluminum and copper
  • General purpose cleaning: Pre and Post-CVD oxides, postmetallization, surface topography, trench
  • Silicon cleaning: prime silicon, reclaim silicon, fab monitor reclaim

STANDARD FEATURES INCLUDE:

  • 200mm ergonomic load station
  • Double sided PVA scrub
  • Dual brush boxes
  • Dark plastic covers protect light sensitive wafers
  • Ammonia dispense
  • IR assisted spin dry station
  • Robotic unload
  • Vertical unload station
  • Touchscreen controls

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NEWS AND EVENTS

 

Axus Partners with CP Display to Accelerate Monolithic 1080p MicroLED Displays to Mainstream AR

Axus partners with Compound Photonics US Corporation to accelerate sub 5 µm pixel microLED development to the mass market.

Axus and CP are partnering to integrate critical wafer-scale processes needed for mass-production scale up of CP’s 3 µm pixel, 0.26” diagonal, 1080p microLED displays for the next generation AR glasses. Specifically, Axus will deploy its state-of-the-art Capstone CMP system with integrated post-CMP clean to enable wafer planarization and surface preparation process solutions for successful wafer-scale bonding of microLED wafers to high-performance CMOS backplanes.

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Axus/Plessey Partnership

Axus partners with Plessey Semiconductors to help bring high-performance GaN-on-Silicon monolithic microLED technology to the mass market.

Using tooling from Axus and optimised processes, Plessey Semiconductors has achieved a successful wafer to wafer bond of a 1080p microLED display 0.26” diagonal to a 3-micron pixel-pitch backplane. Much smaller than the 0.7" diagonal 8-micron pixel-pitch active-matrix display previously demonstrated.

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