


OnTrak DSS 200 Series 2 double-sided PVA scrubber offers production-proven cleaning results for removing slurry particles. Depending on the application, throughputs of 45-65 wafers per hour are attainable, making the DSS-200 Series 2 the most cost-effective wafer cleaning system for wafers from 100mm to 200mm.
The DSS-200 Series 2 can accommodate a wide range of cleaning process applications such as:
- Post-CMP cleaning: oxide, polysilicon, nitride, tungsten, aluminum and copper
- General purpose cleaning: Pre and Post-CVD oxides, postmetallization, surface topography, trench
- Silicon cleaning: prime silicon, reclaim silicon, fab monitor reclaim
STANDARD FEATURES INCLUDE:
- 200mm ergonomic load station
- Double sided PVA scrub
- Dual brush boxes
- Dark plastic covers protect light sensitive wafers
- Ammonia dispense
- IR assisted spin dry station
- Robotic unload
- Vertical unload station
- Touchscreen controls
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NEWS & EVENTS
Chandler, Arizona, USA, – Axus Technology (Axus), a leading global provider of CMP, wafer thinning and wafer surface processing solutions for semiconductor applications, is excited to be partnering with GE Research, GE Aviation Systems, and InertiaWave, Inc. on the production of an innovative single-chip device. SEMI, through their MEMS & Sensors Industry Group (MSIG) and FlexTech Group has provided a......Read More...