Ontrak DSS200 Series 2

OnTrak DSS 200 Series 2 double-sided PVA scrubber offers production-proven cleaning results for removing slurry particles. Depending on the application, throughputs of 45-65 wafers per hour are attainable, making the DSS-200 Series 2 the most cost-effective wafer cleaning system for wafers from 100mm to 200mm.

The DSS-200 Series 2 can accommodate a wide range of cleaning process applications such as:

• Post-CMP cleaning: oxide, polysilicon, nitride, tungsten, aluminum and copper
• General purpose cleaning: Pre and Post-CVD oxides, postmetallization, surface topography, trench
• Silicon cleaning: prime silicon, reclaim silicon, fab monitor reclaim

STANDARD FEATURES INCLUDE:

• 200mm ergonomic load station
• Double sided PVA scrub
• Dual brush boxes
• Dark plastic covers protect light sensitive wafers
• Ammonia dispense
• IR assisted spin dry station
• Robotic unload
• Vertical unload station
• Touchscreen controls