The Axus Surface wafer polisher is a fully automated, precision tool for CMP polishing of semiconductor wafers used to achieve flatness, uniformity and planarization on patterned/device wafers. The Surface, which is based on the IPEC 472 chassis, features automatic wafer handling and is capable of two-platen, two-step polishing processing to maximize wafer throughput capability and quality. Designed to planarize wafers from 100mm to 200mm, the Surface is ideally suited for material polishing applications that require repeatability with operational and processing flexibility. The Surface comes standard with a 4-pass pneumatic system for carrier control and is 200mm ready. Many membrane carrier options are available for the Surface making it a very versatile polishing tool for all types of substrates. This tool has a long list of options that are not offered with refurbished tools such as; final pad conditioning system, high pressure platen rinse, clear wafer sensing, improved wafer handling for thin substrates and motor and optical end point detection systems.
STANDARD FEATURES INCLUDE:
- Fully automated precision polishing
- Two platen process for post polish buff
- Multiple slurry dispense
- In-situ pad conditioner
- Material compatibility for medium and low pH slurries (1-12)
- Down force up to 750lbs
- Controllable wafer back pressure
- Polish head clean station
- External interface for end point capability
- Temperature controlled platens
- Motor current end point
- Thin wafer handling solutions
- Clear wafer sensing solutions
- Wide variety of membrane carrier options
- Final platen conditioning system
- CMP-Idle-Mode Water Recirculating System
- Optical EndPoint Detection
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NEWS AND EVENTS
Axus Partners with CP Display to Accelerate Monolithic 1080p MicroLED Displays to Mainstream AR
Axus partners with Compound Photonics US Corporation to accelerate sub 5 µm pixel microLED development to the mass market.
Axus and CP are partnering to integrate critical wafer-scale processes needed for mass-production scale up of CP’s 3 µm pixel, 0.26” diagonal, 1080p microLED displays for the next generation AR glasses. Specifically, Axus will deploy its state-of-the-art Capstone CMP system with integrated post-CMP clean to enable wafer planarization and surface preparation process solutions for successful wafer-scale bonding of microLED wafers to high-performance CMOS backplanes.
Axus partners with Plessey Semiconductors to help bring high-performance GaN-on-Silicon monolithic microLED technology to the mass market.
Using tooling from Axus and optimised processes, Plessey Semiconductors has achieved a successful wafer to wafer bond of a 1080p microLED display 0.26” diagonal to a 3-micron pixel-pitch backplane. Much smaller than the 0.7" diagonal 8-micron pixel-pitch active-matrix display previously demonstrated.