One of the primary requirements of IC manufacturing is the quest to eliminate surface defects. The residual defectivity following the CMP process, sometimes referred to as “killer defects” hits fab yield hard. Slurry particles must be removed with a combination of chemical cleaning and agitation or scrubbing action, which is provided by very soft PVA brushes while the wafer rotates within the isolated brush boxes.
Wafers are held by edge grip mechanical arms during the cleaning process for edge-only contact, and are rinsed with D.I. water and sometimes an added chemical. Megasonic water dispensing in an isolated spin-rinse-dry area also enhances the cleaning experience. The wafers are put through a drying station and are placed in the receive cassette clean, and dry and ready for down-stream processing.
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Axus partners with Plessey Semiconductors to help bring high-performance GaN-on-Silicon monolithic microLED technology to the mass market.
Using tooling from Axus and optimised processes, Plessey Semiconductors has achieved a successful wafer to wafer bond of a 1080p microLED display 0.26” diagonal to a 3-micron pixel-pitch backplane. Much smaller than the 0.7" diagonal 8-micron pixel-pitch active-matrix display previously demonstrated.