Your source for leading-edge surface processing solutions

Axus Technology delivers leading-edge CMP, wafer thinning and wafer polishing solutions for semiconductor, MEMS/Nanofabrication, nanofabrication and substrate applications. Axus Technology is the industry expert in providing material processing and CMP foundry services, process tools, and custom configured upgrades that are designed to meet your process and production requirements.  

Customer support services include tool upgrades, robot repair , spare parts, and field service support for a range of CMP and wafer grinding tools, including installed legacy tools. Engineering services include process development, equipment modification and upgrade, and the value engineering of critical components.  Axus also manages surplus equipment transactions and the remarketing of excess spares and materials.  If it involves technical support for polish, grind or planarization, the engineers at Axus Technology have the experience to deliver results.


Axus Technology Hires Semiconductor Industry Veteran As General Manager

Bob Roberts of Axus Technology will be presenting "Technology Transfer for MEMS and Advanced Packaging: Precision Surface Preparation Innovatively Applied to Emerging Technologies" at IMAPS 2017 in Raleigh, NC.  Oct. 11, 2017 at 9:00 am.  Register for this event.

Axus Technology to Distribute Trusval Technology CO2 DI Water Delivery System

Axus Technology Introduces New PCB Planarization Tool

Axus Technology Now Offering Gemini-2 Dual Slurry Delivery System

Axus Technology Announces New Director of Process Technology

Upcoming Events

Axus will be exhibiting at IMAPS Device Packaging Conference in Fountain Hills, AZ, March 7-8, 2018.

Axus will be exhibiting at  Semicon West in San Francisco, CA, July 10-12, 2018.