CAPSTONE CS200-ia

The new Capstone® CS200 series is the next-generation CMP processing tool from Axus Technology offering the best-in-market wafer polishing performance for 100, 150, and 200mm wafer sizes. The state-of-the-art system architecture includes a superior load-polish-unload sequence for high throughput process capability and reduced system footprint. Capstone® provides more efficient application and utilization of chemical mechanical polishing slurry, offering a 40-50% reduction in slurry consumption. The unique pad conditioning system also provides up to double the pad life of other CMP tools. The Capstone® CS200 series is the wafer processing equipment of the future and brings significant reduction in CoO, substantially reducing overall CMP process costs.

In need of SiC Processing? The state-of-the-art Capstone® CMP system, coupled with our Crystal carrier (specifically designed for fragile wafer handling and advanced profile control), delivers premium-quality silicon carbide substrates with sub-micron TTV and sub-Angstrom surface finish.

CS200-ia (Integrated Aquarius Cleaner Configuration):

• Advanced CMP System with fully integrated Double Sided Post-CMP cleaner for dry-in, dry-out applications
• True Bridge tool, can run two different wafer sizes simultaneously

STANDARD FEATURES:

• Multizone Wafer Carriers (Avalon, Crystal, Fulcrum)
• 100mm, 150mm, and 200mm capable
• Completely Independent Wafer Movement
• Unlimited Wafer Flip Capability
• Linear Pad Conditioner with Symmetrical Travel Pattern
• High Pressure D.I. Water Rinse Bar
• Minimal Wafer Handling
• Smart-slip Sensor System
• Slurry Flow Controllers
• On-board, State-of-the-Art High Speed Industrial Control Network
• Connectivity
• Fully Integrated Post CMP Cleaner

OPTIONAL FEATURES:

• Optical and Motor Current EPD Systems
• Platen Cooling
• SMIF Version
• Integrated Metrology
• Carrier Leak Tester

OTHER CONFIGURATIONS:

• Capstone CS200-sa
• Capstone CS200-ma

WATCH PRODUCT OVERVIEW:

• Capstone Overview Video