CAPSTONE CS200-sa
The new Capstone® CS200 series is the next-generation CMP processing tool from Axus Technology offering the best-in-market wafer polishing performance for 100, 150, and 200mm wafer sizes. The state-of-the-art system architecture includes a superior load-polish-unload sequence for high throughput process capability and reduced system footprint. Capstone® provides more efficient application and utilization of chemical mechanical polishing slurry, offering a 40-50% reduction in slurry consumption. The unique pad conditioning system also provides up to double the pad life of other CMP tools. The Capstone® CS200 series is the wafer processing equipment of the future and brings significant reduction in CoO, substantially reducing overall CMP process costs.
In need of SiC Processing? The state-of-the-art Capstone® CMP system, coupled with our Crystal carrier (specifically designed for fragile wafer handling and advanced profile control), delivers premium-quality silicon carbide substrates with sub-micron TTV and sub-Angstrom surface finish.
CS200-sa (Standalone Configuration):
- Smallest footprint, most flexible architecture, dual wafer size processing with no hardware or software modification
- True Bridge tool, can run two different wafer sizes simultaneously
STANDARD FEATURES:
- Multizone Wafer Carriers (Avalon, Crystal, Fulcrum)
- 100mm, 150mm, and 200mm capable
- Completely Independent Spindles
- Unlimited Wafer Flip Capability
- Linear Pad Conditioner with Symmetrical Travel Pattern
- High Pressure D.I. Water Rinse Bar
- Minimal Wafer Handling
- Smart-slip Sensor System
- Slurry Flow Controllers
- On-board, State-of-the-Art High Speed Industrial Control Network
- Connectivity
OPTIONAL FEATURES:
- Motor Current EndPoint Detection
- Thin Wafer Handling Solutions
- Clear Wafer Sensing Solutions
- Final Platen Conditioning System
- Capstone Optical EndPoint Detection
- SMIF Version
- Integrated Metrology
- 2 or 4 Cassette Option
- Carrier Leak Tester
