Strasbaugh 7AF

Strasbaugh 7AF advanced wafer grinding solution
Strasbaugh 7AF advanced wafer grinding solution Strasbaugh 7AF Wafer backgrinding Strasbaugh 7AF Ultra-thinning

The Strasbaugh 7AF wafer grinder is an advanced wafer grinding solution for semiconductor, data storage, SOI, LED, and a variety of R&D applications. The 7AF delivers high volume throughput with superior finish and thickness control. The force sensitive mechanics and advanced control system allows adaptive grinding that is determined by grinding wheel dynamics resulting in reduced sub-surface damage and increased product yield.

The unique mechanical design of the 7AF includes two air bearing grind spindles and two air bearing work holding spindles to allow simultaneious course and fine grind steps. Each wafer remains on the same work spindle for both grind steps thus reducing wafer handling and increasing wafer throughput.

VIDEO:

 

DATASHEETS

New CMP Equipment Request Form

Development Lab Process Request Form

Software Request Form

Parts & Services Request Form