Improve or maintain CMP tools to run at their peak potential in support of leading-edge customers, to fulfill their requirements for building the next generation device prototypes.
Drive the development of new CMP tools and tool modifications to enable novel material processing.
Work with an experienced, cutting-edge process engineering team to “push the envelope” for CMP and wafer grinding.
Responsibilities will include, but are not limited to:
On-demand and routine (PM) maintenance of tools.
Learn the inner workings of new CMP tools.
Drive the creation of written SOP’s.
Drive the improvement of existing and new tool designs by providing feedback to and work with the equipment (design) engineering group.
Field support at customer sites is an option (domestic and Europe).
Acquire the knowledge of various CMP and grind processes, its capabilities and shortfalls.
Work closely with other team members showing a positive attitude, effective interaction and communication.
Compliance with all company policies and procedures will be required to promote a safe and efficient work environment.
Perform all related duties as assigned.
Required and Desired Skills:
Bachelor of Science or better in an engineering discipline.
Three to five years of experience in CMP.
Hands-on experience with grinder and/or CMP tools.
Must have strong verbal communication, written, and presentation skills.
Must be able to work under pressure and meet deadlines. This includes managing multiple projects and meet time sensitive objectives with minimal or no supervision.
A positive attitude is essential to the success of this position.
Must be able to maintain regular and punctual attendance consistent with our company policy.
