CMP Equipment

Our team is composed of a prestigious group of highly skilled process and tool engineers and veterans with broad industry experience. We help clients identify their chemical mechanical polishing (CMP) needs and work with them to custom design and develop a CMP process and advanced wafer solutions that fits their requirements to build new and innovative technology.

Our wafer processing services include expertise in the following fields:

• CMP for technology sectors such as 5G, Sensors, Semiconductors, III-V and II-VI Materials, Advanced Packaging, TSV, MEMS, LED, Precision Optical, Photonics, and Nanotechnology.
• Precision Wafer Grinding/Thinning
• Post CMP Wafer Cleaning
• Edge Grinding
• Edge Trim
• Wafer Bonding

In need of SiC Processing? Axus Technology’s recent process improvements have yielded a material removal rate above 10 microns per hour on the silicon face. As a major industry breakthrough for Advanced Single-Wafer Silicon Carbide CMP, we’re providing SiC wafer suppliers with the most advanced CMP system on the market and unmatched performance benefits. The state-of-the-art Cap-stone® CMP system, coupled with our Crystal carrier (specifically designed for thin and fragile wafer handling and advanced profile control), delivers premium-quality SiC substrates with sub-micron TTV and sub-Angstrom surface finish. The net result for Capstone® users is higher throughput while reducing consumables usage and cost of ownership (CoO)