Axus Technology is providing wafer thinning and wafer surface processing for Mosaic Microsystem’s thin glass wafer handling solutions to microelectronic packaging.

Feb 17, 2021 | News

Chandler, Arizona, USA, February 17th, 2021 – Axus Technology (Axus), a leading global provider of CMP, wafer thinning and wafer surface processing solutions for semiconductor applications, is excited to be working with Mosaic Microsystems to build the supply chain...

Axus Technology partners with top industry research leaders on the production of an innovative single-chip device for the PNT market.

Nov 4, 2020 | News

Chandler, Arizona, USA, November 4th, 2020 – Axus Technology (Axus), a leading global provider of CMP, wafer thinning and wafer surface processing solutions for semiconductor applications, is excited to be partnering with GE Research, GE Aviation Systems, and...

Axus Partners with CP Display

Sep 30, 2020 | Case Studies, News

Chandler, Arizona, USA, September 30th, 2020 – Axus Technology (Axus), a leading global provider of CMP, wafer thinning and wafer polishing surfaceprocessing solutions for semiconductor applications, announced today a partnership with Compound Photonics US Corporation...

Axus/Plessey Partnership

Feb 6, 2020 | Case Studies, News

San Francisco, California, USA, February 6th, 2020: Plessey, an embedded technologies developer at the forefront of microLED technology for the augmented reality (AR) and display markets, announces a partnership with Axus Technology (Axus), a leading global provider...