CHANDLER, Ariz., September 24, 2024 – Axus Technology, a leading global provider of chemical mechanical planarization (CMP) equipment, critical for semiconductor and compound semiconductor fabrication, today announced its flagship CapstoneÆ CS200 platform tools offer...
Escalating production of silicon carbide (SiC) semiconductors has driven process technology to innovate at a rapid pace to overcome specific challenges and make the most of the material’s advantages. The primary areas of improvement in SiC materials have been...
Orders Comprise Multiple System Configurations and Applications, Underscoring Capstone’s Flexibility and Axus’s Expertise in Single-Wafer SiC Processing CHANDLER, Ariz., July 8, 2024 – Axus Technology, a leading global provider of chemical mechanical planarization...
As companies around the world are preparing for the growth of AI and the future of technology, Axus Technology has made waves in the semiconductor industry and spearheaded the creation of the most modern, flexible chemical mechanical polishing (CMP) systems capable...
Company to Leverage Funds for Expansion of its CMP Products for Silicon Carbide Device Manufacturing CHANDLER, Ariz., May 29, 2024 – Axus Technology, a leading global provider of chemical mechanical planarization (CMP) equipment, critical for manufacturing...
Review of the Most Common Mistakes found in Today’s Chemical Mechanical Polishing (CMP) Equipment and Services, as well as Tips for Selecting the Right Supplier What is CMP? CMP or Chemical Mechanical Polishing is a necessary development step in the fabrication of...
