Axus Technology’s cutting-edge chemical-mechanical planarization (CMP) technology is well positioned to support key trends redefining how semiconductors are designed, manufactured, and developed. We’ve seen strong market acceptance and validation for our groundbreaking Capstone® CMP and Aquarius™ post-CMP cleaning tools across all CMP applications.
Looking at silicon carbide (SiC) substrates and devices, while this market was projected to grow continuously and significantly in 2024, a number of factors contributed to materially slower growth than was anticipated, particularly in H2. We see strong indicators of a significant rebound in 2025 – again, particularly in H2.
Key contributing trends include further development of advanced packaging technologies and techniques for smaller, more compact and powerful devices, and the impending transition from 150mm to 200mm SiC wafers. We contribute to the thermal management essential to these trends with our in-situ process temperature control technology.
As the feasibility and probability of new materials and applications continuing to scale to larger substrate sizes, including 300mm SiC, become clearer, we recognize the need for further technological advancements to better enable such scaling. Axus Technology will continue on our innovation path to maintain our leadership position during this evolution.
