Platen Restoration Program for Applied Materials Mirra 3400 CMP Tools
The Axus Technology platen restoration program returns Mirra platens to OEM specified flatness and surface finish while also significantly reducing the force required for pad removal. The improved teflon-impregnated surface coating provides a durable and chemistry resistant surface while also significantly easing the pad removal task. User measurements showed a reduction from 40 pounds to 9 pounds of pull force required to remove a typical pad.
Platens can be returned to Axus Technology for restoration either individually or in sets. Each platen is inspected prior to processing to identify any repairs that might also be required. Qualified platens are then stripped of any coating and lapped flat. The improved surface finish is then applied. All platens are inspected and recertified prior to return to the end user.
In the event the platen surface requires repair, Axus Technology engineers will identify the potential for repair, as well as the scope of work for the repair. Platen repairs will be quoted as an additional item, wherever required. Typical repairs have included repairing gouges or deep scratches in the platen surface as well as restoring other incidental platen damage.
In the event a platen cannot be properly repaired, Axus Technology can provide a new platen replacement.
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NEWS AND EVENTS
Axus Technology partners with top industry research leaders on the production of an innovative single-chip device for the PNT market.
Chandler, Arizona, USA, – Axus Technology (Axus), a leading global provider of CMP, wafer thinning and wafer surface processing solutions for semiconductor applications, is excited to be partnering with GE Research, GE Aviation Systems, and InertiaWave, Inc. on the production of an innovative single-chip device. SEMI, through their MEMS & Sensors Industry Group (MSIG) and FlexTech Group has provided a great opportunity and platform to tackle PNT’s (Positioning, Navigation, and Timing) challenges with innovative solutions for GPS-denied environments.
Axus partners with Plessey Semiconductors to help bring high-performance GaN-on-Silicon monolithic microLED technology to the mass market.
Using tooling from Axus and optimised processes, Plessey Semiconductors has achieved a successful wafer to wafer bond of a 1080p microLED display 0.26” diagonal to a 3-micron pixel-pitch backplane. Much smaller than the 0.7" diagonal 8-micron pixel-pitch active-matrix display previously demonstrated.
Axus Partners with CP Display to Accelerate Monolithic 1080p MicroLED Displays to Mainstream AR
Axus partners with Compound Photonics US Corporation to accelerate sub 5 µm pixel microLED development to the mass market.
Axus and CP are partnering to integrate critical wafer-scale processes needed for mass-production scale up of CP’s 3 µm pixel, 0.26” diagonal, 1080p microLED displays for the next generation AR glasses. Specifically, Axus will deploy its state-of-the-art Capstone CMP system with integrated post-CMP clean to enable wafer planarization and surface preparation process solutions for successful wafer-scale bonding of microLED wafers to high-performance CMOS backplanes.