G&P 812 cleaner 2 Double-sided PVA brushes G&P P812L GnP logo G&P 812 cleaner 2 Double-sided PVA brushes G&P P812L GnP logo G&P 812 cleaner 2 Double-sided PVA brushes G&P P812L GnP logo

G&P 812L

G&P 812 cleaner 2 Double-sided PVA brushes

The G&P Technology 812L cleaner can be used as a stand-alone post-CMP cleaning tool or as a perfect companion to the G&P Technology POLI-762 CMP tool. The G&P Technology 812L cleaner can be configured to use the same cleaning consumables set typically used on common CMP planarization tools. This provides a method for process testing using cleaning recipes similar to those used on full-scale integrated production tools. Integration with the POLI-762 provides for automated post-CMP transfer directly into the 812L cleaner’s input station.
For cleaning process development and testing, the 812L can be equipped with an optional Friction and Force Measurement (FFM) system. This innovative system provides a built-in metrology system which allows users to measure contact and surface friction during the cleaning process for clear correlation between operating characteristics and cleaning performance. The FFM measurement also provides a quantitative measurement of consumables’ performance allowing users to monitor process consistency. When added to the 812L, this system can help process engineers and cleaning specialists develop an optimized, predictable and repeatable robust polishing and cleaning process recipe.

STANDARD FEATURES INCLUDE:

  • 200mm and 300mm wafer size
  • 2 Double-sided PVA brushes
  • Auto load
  • Spin rinse dry output station

OPTIONAL FEATURES:

  • Megasonic Unit for enhanced cleaning
  • Quick dump rinse (QDR-1, single tank
  • Quick dump rinse (QDR-2, recycling
  • Cleaner gripper option
  • Integration to POLI-762
  • Friction & Force Measurement

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NEWS AND EVENTS

 

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Axus and CP are partnering to integrate critical wafer-scale processes needed for mass-production scale up of CP’s 3 µm pixel, 0.26” diagonal, 1080p microLED displays for the next generation AR glasses. Specifically, Axus will deploy its state-of-the-art Capstone CMP system with integrated post-CMP clean to enable wafer planarization and surface preparation process solutions for successful wafer-scale bonding of microLED wafers to high-performance CMOS backplanes.

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Axus/Plessey Partnership

Axus partners with Plessey Semiconductors to help bring high-performance GaN-on-Silicon monolithic microLED technology to the mass market.

Using tooling from Axus and optimised processes, Plessey Semiconductors has achieved a successful wafer to wafer bond of a 1080p microLED display 0.26” diagonal to a 3-micron pixel-pitch backplane. Much smaller than the 0.7" diagonal 8-micron pixel-pitch active-matrix display previously demonstrated.

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