G&P 412R
The G&P Technology 412R post-CMP cleaning tool is a compact design that delivers state-of-the-art cleaning for 100mm to 300mm diameter substrates. Ideally suited for development applications, the 412R includes two double-side PVA brush stations, a drying station, and optional megasonic cleaning.
STANDARD FEATURES INCLUDE:
- 100mm to 300mm wafer size
- 2 double-sided PVA brush stations
- Single wafer load rinse station
- Spin rinse dry output station
OPTIONAL FEATURES:
- Megasonic Unit for enhanced cleaning
- Quick dump rinse (QDR-1, single tank
- Quick dump rinse (QDR-2, recycling
- Cleaner gripper option
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