G&P 412R

The G&P Technology 412R post-CMP cleaning tool is a compact design that delivers state-of-the-art cleaning for 100mm to 300mm diameter substrates. Ideally suited for development applications, the 412R includes two double-side PVA brush stations, a drying station, and optional megasonic cleaning.

STANDARD FEATURES INCLUDE:

• 100mm to 300mm wafer size
• 2 double-sided PVA brush stations
• Single wafer load rinse station
• Spin rinse dry output station

OPTIONAL FEATURES:

• Megasonic Unit for enhanced cleaning
• Quick dump rinse (QDR-1, single tank
• Quick dump rinse (QDR-2, recycling
• Cleaner gripper option