G&P 412R

The G&P Technology 412R post-CMP cleaning tool is a compact design that delivers state-of-the-art cleaning for 100mm to 300mm diameter substrates. Ideally suited for development applications, the 412R includes two double-side PVA brush stations, a drying station, and optional megasonic cleaning.

STANDARD FEATURES INCLUDE:

  • 100mm to 300mm wafer size
  • 2 double-sided PVA brush stations
  • Single wafer load rinse station
  • Spin rinse dry output station

OPTIONAL FEATURES:

  • Megasonic Unit for enhanced cleaning
  • Quick dump rinse (QDR-1, single tank
  • Quick dump rinse (QDR-2, recycling
  • Cleaner gripper option

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Axus/Plessey Partnership

Axus partners with Plessey Semiconductors to help bring high-performance GaN-on-Silicon monolithic microLED technology to the mass market.

Using tooling from Axus and optimised processes, Plessey Semiconductors has achieved a successful wafer to wafer bond of a 1080p microLED display 0.26” diagonal to a 3-micron pixel-pitch backplane. Much smaller than the 0.7" diagonal 8-micron pixel-pitch active-matrix display previously demonstrated.

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Axus will be exhibiting at IMAPS Device Packaging Conference 2020 in Fountain Hills, AZ, March 3-4, 2020

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Axus will be exhibiting at Semicon West 2020 in San Francisco, CA July 21-23, 2020

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