





The G&P Technology 412R post-CMP cleaning tool is a compact design that delivers state-of-the-art cleaning for 100mm to 300mm diameter substrates. Ideally suited for development applications, the 412R includes two double-side PVA brush stations, a drying station, and optional megasonic cleaning.
STANDARD FEATURES INCLUDE:
- 100mm to 300mm wafer size
- 2 double-sided PVA brush stations
- Single wafer load rinse station
- Spin rinse dry output station
OPTIONAL FEATURES:
- Megasonic Unit for enhanced cleaning
- Quick dump rinse (QDR-1, single tank
- Quick dump rinse (QDR-2, recycling
- Cleaner gripper option
DATASHEETS
Contact for
Equipment
Development Lab
Process Request Form
Request for
Parts & ServiceS
NEWS & EVENTS
Chandler, Arizona, USA, – Axus Technology (Axus), a leading global provider of CMP, wafer thinning and wafer surface processing solutions for semiconductor applications, is excited to be partnering with GE Research, GE Aviation Systems, and InertiaWave, Inc. on the production of an innovative single-chip device. SEMI, through their MEMS & Sensors Industry Group (MSIG) and FlexTech Group has provided a......Read More...