G&P Cleaner 412S
The G&P Technology 412S post-CMP cleaning tool is popular with R & D laboratories and start-up organizations who need a high quality, simple to use, single brush box, stand-alone post CMP wafer cleaning tool . The G & P Technology 412S cleaner can be configured to use the same cleaning consumables set typically used on integrated CMP planarization tools. This cleaner provides a method for using cleaning recipes similar to those used on full scale integrated production tools. This makes technology transfer seamless and facilitates shorter time-to market requirements.
STANDARD FEATURES INCLUDE:
- 100mm to 300mm wafer size
- Double-sided PVA brush
- Single wafer load rinse station
- Spin rinse dry output station
OPTIONAL FEATURES:
- Megasonic Unit for enhanced cleaning
- Quick dump rinse (QDR-1, single tank
- Quick dump rinse (QDR-2, recycling
- Cleaner gripper option
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NEWS & EVENTS
Chandler, Arizona, USA, May 4th, 2021 - Axus Technology (Axus), a leading global provider of CMP, wafer thinning and wafer surface processing solutions for semiconductor applications, has been working diligently to develop and improve leading-edge CMP process performance and hardware capability for advanced single-wafer silicon carbide (SiC) CMP applications. The primary focus of these efforts include: 1) thin/fragile wafer handling......Read More...
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