





The G&P Technology 412S post-CMP cleaning tool is popular with R & D laboratories and start-up organizations who need a high quality, simple to use, single brush box, stand-alone post CMP wafer cleaning tool . The G & P Technology 412S cleaner can be configured to use the same cleaning consumables set typically used on integrated CMP planarization tools. This cleaner provides a method for using cleaning recipes similar to those used on full scale integrated production tools. This makes technology transfer seamless and facilitates shorter time-to market requirements.
STANDARD FEATURES INCLUDE:
- 100mm to 300mm wafer size
- Double-sided PVA brush
- Single wafer load rinse station
- Spin rinse dry output station
OPTIONAL FEATURES:
- Megasonic Unit for enhanced cleaning
- Quick dump rinse (QDR-1, single tank
- Quick dump rinse (QDR-2, recycling
- Cleaner gripper option
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NEWS & EVENTS
Chandler, Arizona, USA, – Axus Technology (Axus), a leading global provider of CMP, wafer thinning and wafer surface processing solutions for semiconductor applications, is excited to be partnering with GE Research, GE Aviation Systems, and InertiaWave, Inc. on the production of an innovative single-chip device. SEMI, through their MEMS & Sensors Industry Group (MSIG) and FlexTech Group has provided a......Read More...