The 7AA combines proven vertical down-feed grinding technology with force adaptive grinding. The 7AA lowers the diamond wheels onto the wafer limiting the total downforce that can be applied to the wafer to a predetermined maximum. This protects the machine, the diamond wheels, and your valuable product from being overstressed, yet allows the machine to grind at its maximum possible rate.
The 7AA also uses closed loop thickness control to reduce thickness errors and eliminate regrinds. Through continuous monitoring the computer determines if the final thickness varies from the target thickness and adjusts the grind spindle position.
The manual version uses the same grinding method and built-in measurement technologies as the automated tool. The manual tool allows for processing of non-standard shapes and substrates up to 300mm in diameter. Using templates and appropriate size wafer chucks, the 7AA manual tool supports processes for a wide range of materials as well as various shapes and sizes.
STANDARD FEATURES INCLUDE:
- Concentrically mounted grinding wheels on a single air bearing downfeed spindle for easy alignment and dual grind capability
- Single vacuum chuck on an air bearing lower spindle for stock removal and fine finishing
- Dual input and dual output cassettes enable continuous operation
- Centering station aligns wafers before a three-arm, two position pick-and- place robot transfers the wafers through the system
- Inline SRD rinses and brushes each wafer, then spins to enhance drying
- Post-grind inline LVDT measurement system feeds thickness results from each wafer back into the software to enhance thickness repeatability
OPTIONAL FEATURES INCLUDE:
Process Request Form
Parts & ServiceS
NEWS AND EVENTS
Axus Partners with CP Display to Accelerate Monolithic 1080p MicroLED Displays to Mainstream AR
Axus partners with Compound Photonics US Corporation to accelerate sub 5 µm pixel microLED development to the mass market.
Axus and CP are partnering to integrate critical wafer-scale processes needed for mass-production scale up of CP’s 3 µm pixel, 0.26” diagonal, 1080p microLED displays for the next generation AR glasses. Specifically, Axus will deploy its state-of-the-art Capstone CMP system with integrated post-CMP clean to enable wafer planarization and surface preparation process solutions for successful wafer-scale bonding of microLED wafers to high-performance CMOS backplanes.
Axus partners with Plessey Semiconductors to help bring high-performance GaN-on-Silicon monolithic microLED technology to the mass market.
Using tooling from Axus and optimised processes, Plessey Semiconductors has achieved a successful wafer to wafer bond of a 1080p microLED display 0.26” diagonal to a 3-micron pixel-pitch backplane. Much smaller than the 0.7" diagonal 8-micron pixel-pitch active-matrix display previously demonstrated.