Discon DFG8560 Disco DFG8560 Discon DFG8560 Disco DFG8560 Discon DFG8560 Disco DFG8560

Disco DFG8560

Disco DFG8560 300mm capable surface grinder

Disco DFG8560 system is a 300mm capable, fully automatic in-feed surface grinder. Using the same basic layout as the DFG8540 grinder, this two-spindle, three-chuck design is capable of performing both large diameter and thin-finish grinding. The software and GUI interface are similar to the DFG8540.

STANDARD FEATURES INCLUDE:

  • Automated thinning up to 300mm diameter wafers
  • Ultra-thin wafer handling to100μm and less
  • DBG option available and plasma-ready
  • Flat/Notch alignment orientation
  • Interior grind water nozzle
  • Chuck/Spinner table
  • Positioning and stopping system
  • 2 air bearing grind spindles,3 rotary-chuck tables

OPTIONAL FEATURES:

  • Temperature control system for stabilizing process results
  • Vacuum system
  • Integration with DBG
  • Integration with Disco polisher model DFP8140
  • Filtration system

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NEWS AND EVENTS

 

Axus/Plessey Partnership

Axus partners with Plessey Semiconductors to help bring high-performance GaN-on-Silicon monolithic microLED technology to the mass market.

Using tooling from Axus and optimised processes, Plessey Semiconductors has achieved a successful wafer to wafer bond of a 1080p microLED display 0.26” diagonal to a 3-micron pixel-pitch backplane. Much smaller than the 0.7" diagonal 8-micron pixel-pitch active-matrix display previously demonstrated.

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