Disco DFG850 Disco DFG850 Disco DFG850 Disco DFG850 Disco DFG850 Disco DFG850

Disco DFG850

Disco DFG850 wafer grinder

Disco DFG850 system features two air bearing grind spindles, a rotating table with three rotating vacuum wafer chucks, and robotic load/unload operation. This provides high-quality ultra- thin grinding for applications including 3D integration, BSI, bonded wafers, IC slim cards, and more

STANDARD FEATURES INCLUDE:

  • Grinds wafers 100 – 200mm
  • In-feed grinding with wafer rotation
  • Two independently adjustable spindles
  • Porous vacuum wafer chucks
  • 2-point contact in-process thickness gauging
  • 200mm diamond grinding wheel
  • 2 cassettes for load/unload

OPTIONAL FEATURES:

  • Temperature control system for stabilizing process results
  • Vacuum system
  • Filtration system

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NEWS AND EVENTS

 

Axus/Plessey Partnership

Axus partners with Plessey Semiconductors to help bring high-performance GaN-on-Silicon monolithic microLED technology to the mass market.

Using tooling from Axus and optimised processes, Plessey Semiconductors has achieved a successful wafer to wafer bond of a 1080p microLED display 0.26” diagonal to a 3-micron pixel-pitch backplane. Much smaller than the 0.7" diagonal 8-micron pixel-pitch active-matrix display previously demonstrated.

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Axus will be exhibiting at Semicon West 2020 in San Francisco, CA July 21-23, 2020

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