Disco DFG850

Disco DFG850 system features two air bearing grind spindles, a rotating table with three rotating vacuum wafer chucks, and robotic load/unload operation. This provides high-quality ultra- thin grinding for applications including 3D integration, BSI, bonded wafers, IC slim cards, and more

STANDARD FEATURES INCLUDE:

  • Grinds wafers 100 – 200mm
  • In-feed grinding with wafer rotation
  • Two independently adjustable spindles
  • Porous vacuum wafer chucks
  • 2-point contact in-process thickness gauging
  • 200mm diamond grinding wheel
  • 2 cassettes for load/unload

OPTIONAL FEATURES:

  • Temperature control system for stabilizing process results
  • Vacuum system

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