Disco DFG850

Disco DFG850 system features two air bearing grind spindles, a rotating table with three rotating vacuum wafer chucks, and robotic load/unload operation. This provides high-quality ultra- thin grinding for applications including 3D integration, BSI, bonded wafers, IC slim cards, and more

STANDARD FEATURES INCLUDE:

• Grinds wafers 100 – 200mm
• In-feed grinding with wafer rotation
• Two independently adjustable spindles
• Porous vacuum wafer chucks
• 2-point contact in-process thickness gauging
• 200mm diamond grinding wheel
• 2 cassettes for load/unload

OPTIONAL FEATURES:

• Temperature control system for stabilizing process results
• Vacuum system
• Filtration system