


Disco DFG850 system features two air bearing grind spindles, a rotating table with three rotating vacuum wafer chucks, and robotic load/unload operation. This provides high-quality ultra- thin grinding for applications including 3D integration, BSI, bonded wafers, IC slim cards, and more
STANDARD FEATURES INCLUDE:
- Grinds wafers 100 – 200mm
- In-feed grinding with wafer rotation
- Two independently adjustable spindles
- Porous vacuum wafer chucks
- 2-point contact in-process thickness gauging
- 200mm diamond grinding wheel
- 2 cassettes for load/unload
OPTIONAL FEATURES:
- Temperature control system for stabilizing process results
- Vacuum system
- Filtration system
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NEWS & EVENTS
Chandler, Arizona, USA, – Axus Technology (Axus), a leading global provider of CMP, wafer thinning and wafer surface processing solutions for semiconductor applications, is excited to be partnering with GE Research, GE Aviation Systems, and InertiaWave, Inc. on the production of an innovative single-chip device. SEMI, through their MEMS & Sensors Industry Group (MSIG) and FlexTech Group has provided a......Read More...