Disco DFG841
Disco DFG841 system, with two grind spindles, two wafer vacuum chucks, and a robot arm, features a same-cassette return function. The robot arm vacuum feature ensures that even thin-ground wafers, which are prone to warping, are corrected to the required flatness or trouble-free handling. For safety, the DFG841 complies with the EC’s CE marking and is based on SEMI S2-93.
STANDARD FEATURES INCLUDE:
- Grinds wafers 100 – 200mm
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In-feed grinding with wafer rotation
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Two independently adjustable spindles
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Porous chuck table with vacuum chuck
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200mm diamond grinding wheel
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2 cassettes for load/unload
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DFG841 complies with the EC’s CE requirements
OPTIONAL FEATURES:
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Temperature control system for stabilizing process results
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Vacuum system
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