Disco DFG841 Disco DFG841 Disco DFG841 Disco DFG841

Disco DFG841

Disco DFG841 wafer grinding system
Disco DFG841 system, with two grind spindles, two wafer vacuum chucks, and a robot arm, features a same-cassette return function. The robot arm vacuum feature ensures that even thin-ground wafers, which are prone to warping, are corrected to the required flatness or trouble-free handling. For safety, the DFG841 complies with the EC’s CE marking and is based on SEMI S2-93.

STANDARD FEATURES INCLUDE:

  • Grinds wafers 100 – 200mm
  • In-feed grinding with wafer rotation
  • Two independently adjustable spindles
  • Porous chuck table with vacuum chuck
  • 200mm diamond grinding wheel
  • 2 cassettes for load/unload
  • DFG841 complies with the EC’s CE requirements

OPTIONAL FEATURES:

  • Temperature control system for stabilizing process results
  • Vacuum system
  • Filtration system

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NEWS AND EVENTS

 

Axus/Plessey Partnership

Axus partners with Plessey Semiconductors to help bring high-performance GaN-on-Silicon monolithic microLED technology to the mass market.

Using tooling from Axus and optimised processes, Plessey Semiconductors has achieved a successful wafer to wafer bond of a 1080p microLED display 0.26” diagonal to a 3-micron pixel-pitch backplane. Much smaller than the 0.7" diagonal 8-micron pixel-pitch active-matrix display previously demonstrated.

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