Industrial Polisher

UltraPro 3D precision polisher for 3-dimensional components

UltraPro 3D polisher for 3-dimensional components

precision polishing of round, square, and rectangular 3-dimensional components

With the UltraPRo 3D-II Robotic Assisted Polisher, Axus Technology introduces a completely automated system for precision polishing of round, square, and rectangular 3-dimensional components. This polisher incorporates an industrial grade, 6-axis articulated robot with unique force/torque sensing and control capability as the polishing mechanism.

STANDARD FEATURES INCLUDE:

High quality industrial grade, 6-axis articulated robot with force/torque sensing and control
Multi-recipe driven system with multi-step programming capability
Multi-unit tool center tray design
Vacuum chuck work holding platen for up to 17-inch (432 mm) diameter parts (larger systems are available)
Vacuum pumping system with automatic fluid drain
Programmable variable speed platen
Polishing slurry reservoir, mixing and distribution system
Compact footprint
Automatic polishing pad conditioning system
LCD Flat Panel Display – water resistant
OPC server on the HMI to download process performance data
PLC controller with EtherCAT embedded PC master

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NEWS & EVENTS

POSTED ON Wednesday February 17, 2021

Axus Technology is providing wafer thinning and wafer surface processing for Mosaic Microsystem’s thin glass wafer handling solutions to microelectronic packaging.

Chandler, Arizona, USA, – Axus Technology (Axus), a leading global provider of CMP, wafer thinning and wafer surface processing solutions for semiconductor applications, is excited to be partnering with GE Research, GE Aviation Systems, and InertiaWave, Inc. on the production of an innovative single-chip device. SEMI, through their MEMS & Sensors Industry Group (MSIG) and FlexTech Group has provided a......Read More...