UltraPro 3D 3 dimensional polisher UltraPRo 3D-II UltraPro3D logo UltraPro 3D Robotic Assisted Polisher UltraPRo 3D-II UltraPro3D logo UltraPro 3D Industrial polisher UltraPRo 3D-II UltraPro3D logo

Industrial Polisher

UltraPro 3D industrial polisher
UltraPro 3D precision polisher for 3-dimensional components UltraPro 3D polisher for 3-dimensional components precision polishing of round, square, and rectangular 3-dimensional components

With the UltraPRo 3D-II Robotic Assisted Polisher, Axus Technology introduces a completely automated system for precision polishing of round, square, and rectangular 3-dimensional components. This polisher incorporates an industrial grade, 6-axis articulated robot with unique force/torque sensing and control capability as the polishing mechanism.

STANDARD FEATURES INCLUDE:

  • High quality industrial grade, 6-axis articulated robot with force/torque sensing and control
  • Multi-recipe driven system with multi-step programming capability
  • Multi-unit tool center tray design
  • Vacuum chuck work holding platen for up to 17-inch (432 mm) diameter parts (larger systems are available)
  • Vacuum pumping system with automatic fluid drain
     
  • Programmable variable speed platen
  • Polishing slurry reservoir, mixing and distribution system
  • Compact footprint
  • Automatic polishing pad conditioning system
  • LCD Flat Panel Display – water resistant
  • OPC server on the HMI to download process performance data
  • PLC controller with EtherCAT embedded PC master

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NEWS AND EVENTS

 

Axus Partners with CP Display to Accelerate Monolithic 1080p MicroLED Displays to Mainstream AR

Axus partners with Compound Photonics US Corporation to accelerate sub 5 µm pixel microLED development to the mass market.

Axus and CP are partnering to integrate critical wafer-scale processes needed for mass-production scale up of CP’s 3 µm pixel, 0.26” diagonal, 1080p microLED displays for the next generation AR glasses. Specifically, Axus will deploy its state-of-the-art Capstone CMP system with integrated post-CMP clean to enable wafer planarization and surface preparation process solutions for successful wafer-scale bonding of microLED wafers to high-performance CMOS backplanes.

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Axus/Plessey Partnership

Axus partners with Plessey Semiconductors to help bring high-performance GaN-on-Silicon monolithic microLED technology to the mass market.

Using tooling from Axus and optimised processes, Plessey Semiconductors has achieved a successful wafer to wafer bond of a 1080p microLED display 0.26” diagonal to a 3-micron pixel-pitch backplane. Much smaller than the 0.7" diagonal 8-micron pixel-pitch active-matrix display previously demonstrated.

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