Inspection System

  • Surface defects are detected and measured using fully integrated Hologenix optics
  • Uses defocused optics for finding surface defects ( dimples or mounds )
  • Typical for wafer polishing defects
  • Perfect for finding Post CMP over and under polished areas
  • Also used for Post wafer bond MEMS defect inspection
  • 150mm / 200mm / 300mm versions
  • Whole wafer image processing or magnified version are available
  • Optional stocker and agv integrated e84 delivery

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Axus will be exhibiting at IWLPC 2019 in San Jose, CA, Oct 22-24, 2019, Booth #18.

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Axus will be exhibiting at IMAPS Device Packaging Conference 2020 in Fountain Hills, AZ, March 3-4, 2020

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Axus will be exhibiting at Semicon West 2020 in San Francisco, CA July 21-23, 2020

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7001 W. Erie St. Suite 1, Chandler, AZ 85226 
(480) 705-8000