Inspection System Inspection System
inspection system

Inspection System

  • Surface defects are detected and measured using fully integrated Hologenix optics
  • Uses defocused optics for finding surface defects ( dimples or mounds )
  • Typical for wafer polishing defects
  • Perfect for finding Post CMP over and under polished areas
  • Also used for Post wafer bond MEMS defect inspection
  • 150mm / 200mm / 300mm versions
  • Whole wafer image processing or magnified version are available
  • Optional stocker and agv integrated e84 delivery

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NEWS AND EVENTS

 

Axus/Plessey Partnership

Axus partners with Plessey Semiconductors to help bring high-performance GaN-on-Silicon monolithic microLED technology to the mass market.

Using tooling from Axus and optimised processes, Plessey Semiconductors has achieved a successful wafer to wafer bond of a 1080p microLED display 0.26” diagonal to a 3-micron pixel-pitch backplane. Much smaller than the 0.7" diagonal 8-micron pixel-pitch active-matrix display previously demonstrated.

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Visit Us At

Axus will be exhibiting at Semicon West 2020 in San Francisco, CA July 21-23, 2020

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