Inspection System - AxusTech

inspection system

Inspection System

  • Surface defects are detected and measured using fully integrated Hologenix optics
  • Uses defocused optics for finding surface defects ( dimples or mounds )
  • Typical for wafer polishing defects
  • Perfect for finding Post CMP over and under polished areas
  • Also used for Post wafer bond MEMS defect inspection
  • 150mm / 200mm / 300mm versions
  • Whole wafer image processing or magnified version are available
  • Optional stocker and agv integrated e84 delivery

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