


The Strasbaugh 6DS-SP CMP System is a robust and reliable CMP platform delivering low-cost, high yield processes for 100mm to 200mm diameter material.
STANDARD FEATURES INCLUDE:
- Membrane wafer carriers for improved process performance
- Dual polishing platens for one or two-step processes
- Dual polishing spindles for 100-200mm wafers and higher throughput
- Proven process performance for dielectrics, metals, poly, and STI
- Pad conditioning system provides in-situ programmable selective pad conditioning with 20 zones of programmable control
- Four cassette elevators, with robotic load/unload system
- Hydrolift load station provides better reliability and improved cleanliness
OPTIONAL FEATURES:
- Various styles of multi-zone membrane wafer carriers for improved uniformity and edge control performance
- Wafer size conversion kits
- Slurry blending and distribution system
- Temperature control of primary polishing platen
- Secondary platen pad conditioning system
- Vacuum system with automatic fluid separation unit
- Curtain rinse between polishing platens to reduce slurry cross-contamination
- Optical EndPoint Detection
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NEWS & EVENTS
Chandler, Arizona, USA, – Axus Technology (Axus), a leading global provider of CMP, wafer thinning and wafer surface processing solutions for semiconductor applications, is excited to be partnering with GE Research, GE Aviation Systems, and InertiaWave, Inc. on the production of an innovative single-chip device. SEMI, through their MEMS & Sensors Industry Group (MSIG) and FlexTech Group has provided a......Read More...