Strasbaugh 6DS-SP Production CMP System

The Strasbaugh 6DS-SP CMP System is a robust and reliable CMP platform delivering low-cost, high yield processes for 100mm to 200mm diameter material.

STANDARD FEATURES INCLUDE:

• Membrane wafer carriers for improved process performance
• Dual polishing platens for one or two-step processes
• Dual polishing spindles for 100-200mm wafers and higher throughput
• Proven process performance for dielectrics, metals, poly, and STI
• Pad conditioning system provides in-situ programmable selective pad conditioning with 20 zones of programmable control
• Four cassette elevators, with robotic load/unload system
• Hydrolift load station provides better reliability and improved cleanliness

OPTIONAL FEATURES:

• Various styles of multi-zone membrane wafer carriers for improved uniformity and edge control performance
• End Point Determination (EPD) system
• Wafer size conversion kits
• Slurry blending and distribution system
• Temperature control of primary polishing platen
• Secondary platen pad conditioning system
• Vacuum system with automatic fluid separation unit
• Curtain rinse between polishing platens to reduce slurry cross-contamination
• Optical EndPoint Detection