Strasbaugh 6DS-SP Production CMP System Strasbaugh 6DS-SP Dual polishing platens Strasbaugh 6DS-SP Production CMP System Strasbaugh 6DS-SP Dual polishing platens Strasbaugh 6DS-SP Production CMP System

Strasbaugh 6DS-SP Production CMP System

Strasbaugh 6DS-SP Planarizer
Strasbaugh 6DS-SP four cassette elevators Strasbaugh 6DS-SP Planarization tool

The Strasbaugh 6DS-SP CMP System is a robust and reliable CMP platform delivering low-cost, high yield processes for 100mm to 200mm diameter material.

STANDARD FEATURES INCLUDE:

  • Membrane wafer carriers for improved process performance
  • Dual polishing platens for one or two-step processes
  • Dual polishing spindles for 100-200mm wafers and higher throughput
  • Proven process performance for dielectrics, metals, poly, and STI
  • Pad conditioning system provides in-situ programmable selective pad conditioning with 20 zones of programmable control
  • Four cassette elevators, with robotic load/unload system
  • Hydrolift load station provides better reliability and improved cleanliness

OPTIONAL FEATURES:

  • Various styles of multi-zone membrane wafer carriers for improved uniformity and edge control performance
  • Wafer size conversion kits
  • Slurry blending and distribution system
  • Temperature control of primary polishing platen
  • Secondary platen pad conditioning system
  • Vacuum system with automatic fluid separation unit
  • Curtain rinse between polishing platens to reduce slurry cross-contamination
  • Optical EndPoint Detection

DATASHEETS

Contact for

Equipment

Development Lab

Process Request Form

Request for

Parts & ServiceS

NEWS AND EVENTS

 

Axus Partners with CP Display to Accelerate Monolithic 1080p MicroLED Displays to Mainstream AR

Axus partners with Compound Photonics US Corporation to accelerate sub 5 µm pixel microLED development to the mass market.

Axus and CP are partnering to integrate critical wafer-scale processes needed for mass-production scale up of CP’s 3 µm pixel, 0.26” diagonal, 1080p microLED displays for the next generation AR glasses. Specifically, Axus will deploy its state-of-the-art Capstone CMP system with integrated post-CMP clean to enable wafer planarization and surface preparation process solutions for successful wafer-scale bonding of microLED wafers to high-performance CMOS backplanes.

READ MORE

 

Axus/Plessey Partnership

Axus partners with Plessey Semiconductors to help bring high-performance GaN-on-Silicon monolithic microLED technology to the mass market.

Using tooling from Axus and optimised processes, Plessey Semiconductors has achieved a successful wafer to wafer bond of a 1080p microLED display 0.26” diagonal to a 3-micron pixel-pitch backplane. Much smaller than the 0.7" diagonal 8-micron pixel-pitch active-matrix display previously demonstrated.

READ MORE

DOCUMENT LIBRARY    |    CONTACT
© 2020 AXUS TECHNOLOGY. ALL RIGHTS RESERVED
7001 W. Erie St. Suite 1, Chandler, AZ 85226
(480) 705-8000