Strasbaugh 6DS-SP Production CMP System

The Strasbaugh 6DS-SP CMP System is a robust and reliable CMP platform delivering low-cost, high yield processes for 100mm to 200mm diameter material.

STANDARD FEATURES INCLUDE:

Membrane wafer carriers for improved process performance
Dual polishing platens for one or two-step processes
Dual polishing spindles for 100-200mm wafers and higher throughput
Proven process performance for dielectrics, metals, poly, and STI
Pad conditioning system provides in-situ programmable selective pad conditioning with 20 zones of programmable control
Four cassette elevators, with robotic load/unload system
Hydrolift load station provides better reliability and improved cleanliness

OPTIONAL FEATURES:

Various styles of multi-zone membrane wafer carriers for improved uniformity and edge control performance
End Point Determination (EPD) system
Wafer size conversion kits
Slurry blending and distribution system
Temperature control of primary polishing platen
Secondary platen pad conditioning system
Vacuum system with automatic fluid separation unit
Curtain rinse between polishing platens to reduce slurry cross-contamination