Strasbaugh 6DS-SP Production CMP System
The Strasbaugh 6DS-SP CMP System is a robust and reliable CMP platform delivering low-cost, high yield processes for 100mm to 200mm diameter material.
STANDARD FEATURES INCLUDE:
-
Membrane wafer carriers for improved process performance
-
Dual polishing platens for one or two-step processes
-
Dual polishing spindles for 100-200mm wafers and higher throughput
-
Proven process performance for dielectrics, metals, poly, and STI
-
Pad conditioning system provides in-situ programmable selective pad conditioning with 20 zones of programmable control
-
Four cassette elevators, with robotic load/unload system
-
Hydrolift load station provides better reliability and improved cleanliness
OPTIONAL FEATURES:
-
Various styles of multi-zone membrane wafer carriers for improved uniformity and edge control performance
-
End Point Determination (EPD) system
-
Wafer size conversion kits
-
Slurry blending and distribution system
-
Temperature control of primary polishing platen
-
Secondary platen pad conditioning system
-
Vacuum system with automatic fluid separation unit
-
Curtain rinse between polishing platens to reduce slurry cross-contamination
DATASHEETS
ARE YOU READY?
CONTACT US
NEWS AND EVENTS
Axus/Plessey Partnership
Axus partners with Plessey Semiconductors to help bring high-performance GaN-on-Silicon monolithic microLED technology to the mass market.
Using tooling from Axus and optimised processes, Plessey Semiconductors has achieved a successful wafer to wafer bond of a 1080p microLED display 0.26” diagonal to a 3-micron pixel-pitch backplane. Much smaller than the 0.7" diagonal 8-micron pixel-pitch active-matrix display previously demonstrated.
Visit Us At
Axus will be exhibiting at IMAPS Device Packaging Conference 2020 in Fountain Hills, AZ, March 3-4, 2020
DOCUMENT LIBRARY | CONTACT
© 2020 AXUS TECHNOLOGY. ALL RIGHTS RESERVED
7001 W. Erie St. Suite 1, Chandler, AZ 85226
(480) 705-8000
