Strasbaugh 6DS-SP Production CMP System

The Strasbaugh 6DS-SP CMP System is a robust and reliable CMP platform delivering low-cost, high yield processes for 100mm to 200mm diameter material.

STANDARD FEATURES INCLUDE:

  • Membrane wafer carriers for improved process performance
  • Dual polishing platens for one or two-step processes
  • Dual polishing spindles for 100-200mm wafers and higher throughput
  • Proven process performance for dielectrics, metals, poly, and STI
  • Pad conditioning system provides in-situ programmable selective pad conditioning with 20 zones of programmable control
  • Four cassette elevators, with robotic load/unload system
  • Hydrolift load station provides better reliability and improved cleanliness

OPTIONAL FEATURES:

  • Various styles of multi-zone membrane wafer carriers for improved uniformity and edge control performance
  • End Point Determination (EPD) system
  • Wafer size conversion kits
  • Slurry blending and distribution system
  • Temperature control of primary polishing platen
  • Secondary platen pad conditioning system
  • Vacuum system with automatic fluid separation unit
  • Curtain rinse between polishing platens to reduce slurry cross-contamination

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Axus will be exhibiting at IWLPC 2019 in San Jose, CA, Oct 22-24, 2019, Booth #18.

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Axus will be exhibiting at IMAPS Device Packaging Conference 2020 in Fountain Hills, AZ, March 3-4, 2020

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Axus will be exhibiting at Semicon West 2020 in San Francisco, CA July 21-23, 2020

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