IPEC 776

The IPEC 776 is the most widely installed dry-in, dry-out orbital CMP platform available. The 776 includes a fully automated wafer handling system with a Spray Station Assembly used to remove slurry particulates and keep the wafers wet throughout the process

STANDARD FEATURES INCLUDE:

• Four wafer planarizers (polishing modules) with mini environment
• Integrated double side PVA cleaner with dual brush station and SRD
• Three cassette tilter load/unload station
• Post-CMP buff station
• High speed polish drive (0-600RMP)
• Closed loop delta P control; provides operational feedback
• Endpoint detection system
• Robot R1/R2/R3 equipped
• Stainless steel polish bells
• Pad conditioners; one for each two polish modules
• SECS/GEM capable
• Upgraded 5000MHz Pentium

OPTIONAL FEATURES:

• Slurry distribution interface upgrade with multiplexer to signal low slurry
• CPU upgrade to 1GHz CPU plus memory upgrade
• Advanced pad motion control; improves wafer coverage during polishing