IPEC 776 CMP tool IPEC 776 IPEC 776 CMP tool IPEC 776 IPEC 776 CMP tool IPEC 776

IPEC 776

IPEC 776 orbital CMP platform
The IPEC 776 is the most widely installed dry-in, dry-out orbital CMP platform available. The 776 includes a fully automated wafer handling system with a Spray Station Assembly used to remove slurry particulates and keep the wafers wet throughout the process

STANDARD FEATURES INCLUDE:

  • Four wafer planarizers (polishing modules) with mini environment
  • Integrated double side PVA cleaner with dual brush station and SRD
  • Three cassette tilter load/unload station
  • Post-CMP buff station
  • High speed polish drive (0-600RMP)
  • Closed loop delta P control; provides operational feedback
  • Endpoint detection system
  • Robot R1/R2/R3 equipped
  • Stainless steel polish bells
  • Pad conditioners; one for each two polish modules
  • SECS/GEM capable
  • Upgraded 5000MHz Pentium

OPTIONAL FEATURES:

  • Slurry distribution interface upgrade with multiplexer to signal low slurry
  • CPU upgrade to 1GHz CPU plus memory upgrade
  • Advanced pad motion control; improves wafer coverage during polishing

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