IPEC 776

The IPEC 776 is the most widely installed dry-in, dry-out orbital CMP platform available. The 776 includes a fully automated wafer handling system with a Spray Station Assembly used to remove slurry particulates and keep the wafers wet throughout the process

STANDARD FEATURES INCLUDE:

  • Four wafer planarizers (polishing modules) with mini environment
  • Integrated double side PVA cleaner with dual brush station and SRD
  • Three cassette tilter load/unload station
  • Post-CMP buff station
  • High speed polish drive (0-600RMP)
  • Closed loop delta P control; provides operational feedback
  • Endpoint detection system
  • Robot R1/R2/R3 equipped
  • Stainless steel polish bells
  • Pad conditioners; one for each two polish modules
  • SECS/GEM capable
  • Upgraded 5000MHz Pentium

OPTIONAL FEATURES:

  • Slurry distribution interface upgrade with multiplexer to signal low slurry
  • CPU upgrade to 1GHz CPU plus memory upgrade
  • Advanced pad motion control; improves wafer coverage during polishing

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Axus/Plessey Partnership

Axus partners with Plessey Semiconductors to help bring high-performance GaN-on-Silicon monolithic microLED technology to the mass market.

Using tooling from Axus and optimised processes, Plessey Semiconductors has achieved a successful wafer to wafer bond of a 1080p microLED display 0.26” diagonal to a 3-micron pixel-pitch backplane. Much smaller than the 0.7" diagonal 8-micron pixel-pitch active-matrix display previously demonstrated.

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Axus will be exhibiting at IMAPS Device Packaging Conference 2020 in Fountain Hills, AZ, March 3-4, 2020

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Axus will be exhibiting at Semicon West 2020 in San Francisco, CA July 21-23, 2020

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