The IPEC 676 is a Dry-in/Wet-out automated CMP system best suited for metal CMP but can also be used for dielectric CMP processes. It has one of the industry’s smallest footprints. the 676 is designed to improve yields by use of an orbital polishing motion rather than conventional rotational CMP techniques. This leads to improved wafers per square foot in the fab.
STANDARD FEATURES INCLUDE:
- Four wafer planarizers (polishing modules)
- Cassete tilter load/unload station
- Advanced pad motion control
- Advanced through-the-pad slurry distribution method – High speed polish drive (0-600RPM)
- Closed loop delta P control
- Endpoint detection system
- Stainless steel polish bell
- Dual pad conditioning systems
- Upgraded 500MHz Pentium
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Axus Partners with CP Display to Accelerate Monolithic 1080p MicroLED Displays to Mainstream AR
Axus partners with Compound Photonics US Corporation to accelerate sub 5 µm pixel microLED development to the mass market.
Axus and CP are partnering to integrate critical wafer-scale processes needed for mass-production scale up of CP’s 3 µm pixel, 0.26” diagonal, 1080p microLED displays for the next generation AR glasses. Specifically, Axus will deploy its state-of-the-art Capstone CMP system with integrated post-CMP clean to enable wafer planarization and surface preparation process solutions for successful wafer-scale bonding of microLED wafers to high-performance CMOS backplanes.
Axus partners with Plessey Semiconductors to help bring high-performance GaN-on-Silicon monolithic microLED technology to the mass market.
Using tooling from Axus and optimised processes, Plessey Semiconductors has achieved a successful wafer to wafer bond of a 1080p microLED display 0.26” diagonal to a 3-micron pixel-pitch backplane. Much smaller than the 0.7" diagonal 8-micron pixel-pitch active-matrix display previously demonstrated.