IPEC 676

The IPEC 676 is a Dry-in/Wet-out automated CMP system best suited for metal CMP but can also be used for dielectric CMP processes. It has one of the industry’s smallest footprints. the 676 is designed to improve yields by use of an orbital polishing motion rather than conventional rotational CMP techniques. This leads to improved wafers per square foot in the fab.

STANDARD FEATURES INCLUDE:

  • Four wafer planarizers (polishing modules)
  • Cassete tilter load/unload station
  • Advanced pad motion control
  • Advanced through-the-pad slurry distribution method – High speed polish drive (0-600RPM)
  • Closed loop delta P control
  • Endpoint detection system
  • Stainless steel polish bell
  • Dual pad conditioning systems
  • Upgraded 500MHz Pentium

DATASHEETS

ARE YOU READY?

CONTACT US

UPCOMING EVENTS

 

Visit Us At

Axus will be exhibiting at IWLPC 2019 in San Jose, CA, Oct 22-24, 2019, Booth #18.

READ MORE

 

Visit Us At

Axus will be exhibiting at IMAPS Device Packaging Conference 2020 in Fountain Hills, AZ, March 3-4, 2020

READ MORE

 

Visit Us At

Axus will be exhibiting at Semicon West 2020 in San Francisco, CA July 21-23, 2020

READ MORE

 

DOCUMENT LIBRARY    |    CONTACT
© 2019 AXUS TECHNOLOGY. ALL RIGHTS RESERVED
7001 W. Erie St. Suite 1, Chandler, AZ 85226 
(480) 705-8000