GnP POLI-762 Membrane Carrier CMP Tool G&P POLI-762 GnP logo G&P POLI-762 Membrane Carrier CMP Tool G&P POLI-762 GnP logo GnP POLI-762 Membrane Carrier CMP Tool G&P POLI-762 GnP logo

G&P POLI-762

G&P Technology POLI-762 Membrane Carrier CMP Tool

The G&P Technology POLI-762 Membrane Carrier CMP Tool is our most advanced and intelligent CMP tool designed for high versatility for 12”(300mm) CMP process development, materials evaluation and pre-production runs. The POLI-762 was also designed for advanced wafer manufactures and consumables suppliers.

STANDARD FEATURES INCLUDE:

  • Wafer size capacity up to 300mm
  • Rotational speed of the polishing platen & wafer carrier
  • Swing arm style pad conditioner
  • Downforce of the pad conditioning disk
  • Programmable sweep speed of the conditioning arm
  • Oscillation of the wafer carrier on the polishing pad
  • Teflon coated polishing table
  • 3 Slurry pumps

CONDITIONING ARM OPTIONS:

Swing Arm Conditioning (radial sweep)

  • 100mm end effector (standard), 30-200 rpm range
  • Downforce range, .45 – 9.1kgf (1 – 20 lbf)
  • Sweep zone control, 8 segments
  • Sweep rate, 0 – 20 sweep / minute
  • Conditioning disk clean station

DATASHEETS

Contact for

Equipment

Development Lab

Process Request Form

Request for

Parts & ServiceS

NEWS AND EVENTS

 

Axus Partners with CP Display to Accelerate Monolithic 1080p MicroLED Displays to Mainstream AR

Axus partners with Compound Photonics US Corporation to accelerate sub 5 µm pixel microLED development to the mass market.

Axus and CP are partnering to integrate critical wafer-scale processes needed for mass-production scale up of CP’s 3 µm pixel, 0.26” diagonal, 1080p microLED displays for the next generation AR glasses. Specifically, Axus will deploy its state-of-the-art Capstone CMP system with integrated post-CMP clean to enable wafer planarization and surface preparation process solutions for successful wafer-scale bonding of microLED wafers to high-performance CMOS backplanes.

READ MORE

 

Axus/Plessey Partnership

Axus partners with Plessey Semiconductors to help bring high-performance GaN-on-Silicon monolithic microLED technology to the mass market.

Using tooling from Axus and optimised processes, Plessey Semiconductors has achieved a successful wafer to wafer bond of a 1080p microLED display 0.26” diagonal to a 3-micron pixel-pitch backplane. Much smaller than the 0.7" diagonal 8-micron pixel-pitch active-matrix display previously demonstrated.

READ MORE

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