GnP POLI-762 Membrane Carrier CMP Tool G&P POLI-762 GnP logo G&P POLI-762 Membrane Carrier CMP Tool G&P POLI-762 GnP logo GnP POLI-762 Membrane Carrier CMP Tool G&P POLI-762 GnP logo

G&P POLI-762

G&P Technology POLI-762 Membrane Carrier CMP Tool

The G&P Technology POLI-762 Membrane Carrier CMP Tool is our most advanced and intelligent CMP tool designed for high versatility for 12”(300mm) CMP process development, materials evaluation and pre-production runs. The POLI-762 was also designed for advanced wafer manufactures and consumables suppliers.

STANDARD FEATURES INCLUDE:

  • Wafer size capacity up to 300mm
  • Rotational speed of the polishing platen & wafer carrier
  • Swing arm style pad conditioner
  • Downforce of the pad conditioning disk
  • Programmable sweep speed of the conditioning arm
  • Oscillation of the wafer carrier on the polishing pad
  • Teflon coated polishing table
  • 3 Slurry pumps

CONDITIONING ARM OPTIONS:

Swing Arm Conditioning (radial sweep)

  • 100mm end effector (standard), 30-200 rpm range
  • Downforce range, .45 – 9.1kgf (1 – 20 lbf)
  • Sweep zone control, 8 segments
  • Sweep rate, 0 – 20 sweep / minute
  • Conditioning disk clean station

DATASHEETS

Contact for

Equipment

Development Lab

Process Request Form

Request for

Parts & ServiceS

NEWS AND EVENTS

 

Axus Technology partners with top industry research leaders on the production of an innovative single-chip device for the PNT market.

Chandler, Arizona, USA, – Axus Technology (Axus), a leading global provider of CMP, wafer thinning and wafer surface processing solutions for semiconductor applications, is excited to be partnering with GE Research, GE Aviation Systems, and InertiaWave, Inc. on the production of an innovative single-chip device. SEMI, through their MEMS & Sensors Industry Group (MSIG) and FlexTech Group has provided a great opportunity and platform to tackle PNT’s (Positioning, Navigation, and Timing) challenges with innovative solutions for GPS-denied environments.

READ MORE

 

Axus/Plessey Partnership

Axus partners with Plessey Semiconductors to help bring high-performance GaN-on-Silicon monolithic microLED technology to the mass market.

Using tooling from Axus and optimised processes, Plessey Semiconductors has achieved a successful wafer to wafer bond of a 1080p microLED display 0.26” diagonal to a 3-micron pixel-pitch backplane. Much smaller than the 0.7" diagonal 8-micron pixel-pitch active-matrix display previously demonstrated.

READ MORE

 

Axus Partners with CP Display to Accelerate Monolithic 1080p MicroLED Displays to Mainstream AR

Axus partners with Compound Photonics US Corporation to accelerate sub 5 µm pixel microLED development to the mass market.

Axus and CP are partnering to integrate critical wafer-scale processes needed for mass-production scale up of CP’s 3 µm pixel, 0.26” diagonal, 1080p microLED displays for the next generation AR glasses. Specifically, Axus will deploy its state-of-the-art Capstone CMP system with integrated post-CMP clean to enable wafer planarization and surface preparation process solutions for successful wafer-scale bonding of microLED wafers to high-performance CMOS backplanes.

READ MORE

DOCUMENT LIBRARY    |    CAREER    |    CONTACT
© 2020 AXUS TECHNOLOGY. ALL RIGHTS RESERVED
7001 W. Erie St. Suite 1, Chandler, AZ 85226
(480) 705-8000