CAPSTONE CS200-i

The new Capstone® CS200 series is the next-generation CMP processing tool from Axus Technology offering the best-in-market performance for 100, 150, and 200mm wafer sizes. The state-of-the-art system architecture includes a superior load-polish-unload sequence for high throughput process capability and reduced system footprint. Capstone® provides more efficient application and utilization of slurry, providing 40-50% reduction in slurry consumption. The unique pad conditioning system also provides up to double the pad life of other CMP tools. The Capstone® CS200 series brings significant reduction in CoO, substantially reducing overall CMP process costs.

CS200-i (Integrated Cleaner Configuration):

  • Advanced CMP System with fully integrated Double Sided Post-CMP cleaner

Standard Features:

  • Multizone Wafer Carriers (Concentra, Avalon, Crystal)
  • 100mm, 150mm, and 200mm capable
  • Completely Independent Spindles
  • Unlimited Wafer Flip Capability
  • Linear Pad Conditioner with Symmetrical Travel Pattern
  • High Pressure D.I. Water Rinse Bar
  • Minimal Wafer Handling
  • Smart-slip Sensor System
  • Slurry Flow Controllers
  • On-board, State-of-the-Art High Speed Industrial Control Network
  • Connectivity
  • Fully Integrated Post CMP Cleaner

Optional Features:

Other Configurations:

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