Work with a team of highly skilled engineers and technicians to enable the development of key processes for emerging technologies in the semiconductor industry.
Support the CMP, grinding, and wafer thinning group that provides cutting edge technology to build the prototypes for tomorrow’s semiconductor devices.
Acquire the knowledge of various CMP and grind processes, its capabilities and shortfalls.
Provide process recommendation to achieve or enable the customer’s desired results.
Be a key driver in the development of new CMP tools and tool modifications to enable next generation and novel material processing.
Projects will include, but are not limited to:
Enable the build of advanced MEMS and Sensors for devices used in VR/AR applications, mobile, automotive, DOD and life science applications.
Develop processes for new materials and novel combinations thereof.
Improve post CMP cleaning methodologies and reducing defects.
Optimizing metrology measurement techniques for new materials.
Test new CMP tools, parts, and upgrades to evaluate their performance.
Work closely with other team members showing a positive attitude, effective interaction and communication.
Compliance with all company policies and procedures will be required to promote a safe and efficient work environment.
Perform all related duties as assigned.
Required and Desired Skills:
Bachelor of Science or better in an engineering discipline.
Three to five years of experience in CMP.
Hands-on experience with grinder and/or CMP tools.
Must have strong verbal communication, written, and presentation skills.
Must be able to work under pressure and meet deadlines. This includes managing multiple projects and meet time sensitive objectives with minimal or no supervision.
A positive attitude is essential to the success of this position.
Must be able to maintain regular and punctual attendance consistent with our company policy.
