Strasbaugh’s 7AA Advanced Wafer Grinder is an automated in-feed grinder capable of performing a wide variety of grinding applications on wafers ranging from 75 to 150 mm in diameter.
Concentrically mounted grinding wheels on a single air bearing spindle for easy alignment and dual-grind capability
Single-chuck design for stack removal and fine finishing
Three-arm, two position pick and place robot for reliable wafer movement
Dual input and output cassettes for high volume
7AA Manual Version
The manual version uses the same grinding method and built-in measurement technologies as the automated tool. The manual tool allows for processing of non-standard shapes and substrates up to 300 mm in diameter. Using templates and appropriate size wafer chucks, the 7AA manual tool supports processes for a wide range of materials as well as various shapes and sizes.