Strasbaugh 6DS-SP CMP System

Strasbaugh 6DS-SP CMP System is a robust and reliable CMP platform delivering low-cost, high-yield processes for 4” to 200mm diameter material.

Features: Strasbaugh 6DS SP

  • Dual polishing spindles for 100-200mm wafers
  • Dual spindle design provides for both single and double wafer processing, providing a significant throughput advantage 
  • High throughput option increases production up to 30% 
  • Hydrolift Load Station improves loading reliability
  • Two table design enables multi- step process capability
  • Proven process performance for oxides, tungsten and STI applications
  • Pad conditioning system provides in-situ programmable selective pad conditioning with 20 zones of programmable control
  • Optional Axus Technology Titan Carrier Upgrade delivers state-of-the-art process results, adding membrane carrier technology that improves uniformity, edge exclusion and removal rate