OnTrak DSS-200 Series 1 Post CMP Cleaner

OnTrak DSS 200 Series 1 Double-sided PVA Scrubber is designed to clean 100mm to 200mm wafers. It provides consistent, ultra-clean processing for a wide variety of applications.

Standard Features Include:  DSS200-1-xp web

  • Universal load station
  • Double sided PVA scrub 
  • Dual brush boxes 
  • Ammonia dispense
  • IR assisted spin dry station
  • Robotic unload
  • Vertical unload station
  • Touchscreen controls

Optional Features:

  • Megasonics at spin dry station 
  • Wafer size kits for 100 to 200mm 
  • Signal light tower

Process Applications:

The DSS-200 Series 1 is a proven, cost-effective cleaning system for the following applications.

  • Post-Chemical-Mechanical Polishing (CMP) Cleaning: Oxide, Polysilicon, Nitride, Tungsten, Aluminum and Copper 
  • General purpose cleaning: post-CVD oxides, post-metallization, surface topography cleaning, trench cleaning
  • Silicon cleaning: prime silicon; reclaim silicon, fab monitor reclaim