The Okamoto GNX 200 System fully automatic wafer grinder with down-feed grinding method and Robotics wafer handling. The machine can grind semiconductor material such as Si, GaAs and GaP, and can grind electronic material such as ferrite and ceramic. Utilizing the Okamoto grinding method, the machine can achieve high wafer throughput without influencing machining accuracy.
- Precision, high throughput grinding system
- Two step grinding process with low TTV output
- Multiple chuck system maximizes throughput with minimal handling