Disco DFG8540 System

The Disco DFG8540 System is a fully automatic in-feed surface grinder. With its conventional two-spindle, three-chuck design, the DFG8540 is capable of performing both large diameter and thin-finish grinding. The DFG8540’s processing position of the grinding wheel coincides with the chuck table for each spindle for improved grinding performance. 

Features:  DFG8540 small

  • Automated thinning up to 200 mm diameter wafers
  • Ultra-thin wafer handling to 100 µm and less
  • DBG option available and Plasma-ready 
  • Flat/Notch alignment orientation 
  • Interior grind water nozzle 
  • Chuck/Spinner table 
  • Positioning and stopping system 
  • 2 spindles, 3 rotary-chuck table