412R Post CMP Cleaner

The G & P Technology 412R post-CMP cleaning tool is a compact design that delivers state-of-the art cleaning for 100mm to 300mm diameter substrates. Ideally suited for development applications, the 412R includes two double-side PVA brush stations, a drying station, and optional megasonic cleaning. 

Standard Features Include: GnP 412 cleaner Revised

  • Wafer Size Capability, 4”, 150mm, 200mm, 3000mm
  • Double side scrub stations: 2
  • Brush rotation speed: 30 – 200rpm
  • Chemical inputs: 2
  • Through the brush chemical dispense
  • Spray nozzles for chemical dispense: 4
  • Rinse and Spin dry station with N2 assist
  • Single wafer manual load system
  • Intuitive touch screen control


  • Megasonic at rinse station